Cross-architectural design space exploration tool for reconfigurable processors

2009 ◽  
Author(s):  
L. Bauer ◽  
M. Shafique ◽  
J. Henkel
Keyword(s):  
Architectural Design ◽  
Design Space Exploration ◽  
Design Space ◽  
Space Exploration ◽  
Reconfigurable Processors ◽  
Exploration Tool

Experiments with Stochastic Processes: Façade Subdivision based on Wind Motion

2009 ◽  
Vol 7 (3) ◽  
pp. 389-402 ◽  
Author(s):  
Sambit Datta ◽  
Stuart Hanafin ◽  
Gregory Pitts
Keyword(s):  
Stochastic Processes ◽  
Architectural Design ◽  
Design Space Exploration ◽  
Design Space ◽  
Space Exploration ◽  
Building Envelope ◽  
Discrete Version ◽  
Subdivision Scheme ◽  
Motion Model ◽  
Wind Model

Constraint based tools for architectural design exploration need to satisfy aesthetic and functional criteria as well as combine discrete and continuous modes of exploration. In this paper, we examine the possibilities for stochastic processes in design space exploration. Specifically, we address the application of a stochastic wind motion model to the subdivision of an external building envelope into smaller discrete components. Instead of deterministic subdivision constraints, we introduce explicit uncertainty into the system of subdivision. To address these aims, we develop a model of stochastic wind motion; create a subdivision scheme that is governed by the wind model and explore a design space of a façade subdivision problem. A discrete version of the façade, composed of light strips and panels, based on the bamboo elements deformed by continuous wind motion, is developed. The results of the experiments are presented in the paper.

VAET-STT: Variation Aware STT-MRAM Analysis and Design Space Exploration Tool

2018 ◽  
Vol 37 (7) ◽  
pp. 1396-1407 ◽  
Author(s):  
Sarath Mohanachandran Nair ◽  
Rajendra Bishnoi ◽  
Mohammad Saber Golanbari ◽  
Fabian Oboril ◽  
Fazal Hameed ◽  
...  
Keyword(s):  
Design Space Exploration ◽  
Design Space ◽  
Space Exploration ◽  
Analysis And Design ◽  
Exploration Tool

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

2015 ◽  
Author(s):  
Caleb Serafy ◽  
Ankur Srivastava ◽  
Avram Bar-Cohen ◽  
Donald Yeung
Keyword(s):  
Energy Efficiency ◽  
High Performance ◽  
Architectural Design ◽  
Design Space Exploration ◽  
Design Space ◽  
Space Exploration ◽  
New Technology ◽  
Three Dimensional ◽  
Optimization Techniques ◽  
3D Design

Three-dimensional integration (3D IC) is a new technology that shows great potential for high performance and energy efficiency. However past work has shown that 3D ICs suffer from serious thermal issues, and advanced cooling solutions such as micro-fluidic cooling are necessary to realize the true potential of these systems. The interactions between thermal, electrical and physical aspects of a 3D design with micro-fluidic cooling are substantial, and a comprehensive co-design approach to address them simultaneously is a must. Such co-design techniques are required throughout the design process, including during architectural design space exploration (DSE) in order to ensure that optimal design choices are not overlooked. In this paper we propose a DSE framework for 3D CPUs with micro-fluidic cooling that applies electro-thermal optimization techniques to the circuit layout and the heatsink design. By considering such physical optimization techniques we provide a more accurate view of a 3D architecture’s thermal and timing feasibility, as well as its performance and energy efficiency. Using our proposed thermo-electrical-physical co-design DSE framework we are able to improve performance by 1.54x and energy efficiency by 1.26x.

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