Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology

2016 ◽  
Author(s):  
Yaojian Lin ◽  
Chen Kang ◽  
Linda Chua ◽  
Won Kyung Choi ◽  
Seung Wook Yoon
Keyword(s):  
Ball Grid Array ◽  
Wafer Level ◽  
Ball Grid Array Package

Ceramic ball grid array package stress analysis

2017 ◽  
Author(s):  
S. H. B. S. Badri ◽  
M. H. A. Aziz ◽  
N. R. Ong ◽  
Z. Sauli ◽  
J. B. Alcain ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Ball Grid Array ◽  
Ceramic Ball ◽  
Ball Grid Array Package

Challenges for extra large embedded wafer level ball grid array development

2009 ◽  
Author(s):  
Jing-en Luan ◽  
Yonggang Jin ◽  
Kim-yong Goh ◽  
Yiyi Ma ◽  
Guojun Hu ◽  
...  
Keyword(s):  
Ball Grid Array ◽  
Wafer Level

Antenna and Package Design for 61- and 122-GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology

2018 ◽  
Vol 66 (12) ◽  
pp. 5156-5168 ◽  
Author(s):  
Martin Frank ◽  
Torsten Reissland ◽  
Fabian Lurz ◽  
Matthias Voelkel ◽  
Franziska Lambrecht ◽  
...  
Keyword(s):  
Ball Grid Array ◽  
Wafer Level ◽  
Package Design ◽  
Radar Sensors ◽  
Array Technology
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