2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference
Latest Publications

TOTAL DOCUMENTS

112

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424436224, 9781424436248, 9781424436231

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Enabling Future Packaging Innovation Through New Materials

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783851 ◽

2008 ◽

Cited By ~ 1

Author(s):

Peter A. Irvine

Keyword(s):

New Materials

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"Behind the Scenes" of Effective OSP Protection in Pb-free Processing

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783899 ◽

2008 ◽

Author(s):

Witold Paw ◽

Jun Nable ◽

John Swanson

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The Extraction of Dielectric Constant by Using the Metal Insulator Metal Capacitor for the Substrate Material

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783811 ◽

2008 ◽

Author(s):

Tsun-Lung Hsieh ◽

Gwo-Jia Jong ◽

Chih-Wei Wu ◽

Tsung-Lun Lee ◽

Ya-Wen Huang

Keyword(s):

Dielectric Constant ◽

Substrate Material ◽

Metal Insulator ◽

Metal Insulator Metal

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Implementing HDI and Embedded Passives In A High-Reliability Aerospace Application

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783813 ◽

2008 ◽

Author(s):

Happy Holden

Keyword(s):

High Reliability ◽

Aerospace Application ◽

Embedded Passives

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Review on the Ball Drop-off Mechanisms of Lead-free Ball Grid Array Package

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783838 ◽

2008 ◽

Cited By ~ 3

Author(s):

Charlie Tsung-hsing Lu

Keyword(s):

Ball Grid Array ◽

Lead Free ◽

Ball Grid Array Package

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Measurements and Simulation of the Dynamic Characteristics of Micro-Machined Torsion Mirrors

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783828 ◽

2008 ◽

Author(s):

Wei-Hsin Gau ◽

Kun-Nan Chen ◽

Tao-Ching Chang

Keyword(s):

Dynamic Characteristics

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Board Level Reliability Study for CSP with Polymer Cored Solder Ball

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783860 ◽

2008 ◽

Cited By ~ 5

Author(s):

Yen-Ping Wang ◽

Liang Yi Hung ◽

Chiang Cheng Chang ◽

Yu-Po Wang ◽

C.S. Hsiao

Keyword(s):

Solder Ball ◽

Reliability Study ◽

Board Level ◽

Board Level Reliability

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Deformation of Center-Anchored Sector Plate with Double Layer Structure Caused by Induced Thermal Residual Gradient Stress

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783869 ◽

2008 ◽

Author(s):

Meng-Ju Lin

Keyword(s):

Double Layer ◽

Layer Structure ◽

Double Layer Structure ◽

Sector Plate

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Properties of a Newly Developed Immersion Tin Coating

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783896 ◽

2008 ◽

Author(s):

Yung-Herng Yau ◽

Cai Wang ◽

Robert Farrell ◽

PingPing Ye ◽

Ed Kudrak ◽

...

Keyword(s):

Tin Coating ◽

Immersion Tin

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A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783807 ◽

2008 ◽

Cited By ~ 4

Author(s):

Yi-Shao Lai ◽

E. H. Wong ◽

R. Rajoo ◽

S. K. W. Seah ◽

C. S. Selvanayagam ◽

...

Keyword(s):

Impact Test ◽

Drop Impact ◽

Component Level ◽

Ball Impact ◽

Impact Reliability ◽

Board Level

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2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Enabling Future Packaging Innovation Through New Materials

"Behind the Scenes" of Effective OSP Protection in Pb-free Processing

The Extraction of Dielectric Constant by Using the Metal Insulator Metal Capacitor for the Substrate Material

Implementing HDI and Embedded Passives In A High-Reliability Aerospace Application

Review on the Ball Drop-off Mechanisms of Lead-free Ball Grid Array Package

Measurements and Simulation of the Dynamic Characteristics of Micro-Machined Torsion Mirrors

Board Level Reliability Study for CSP with Polymer Cored Solder Ball

Deformation of Center-Anchored Sector Plate with Double Layer Structure Caused by Induced Thermal Residual Gradient Stress

Properties of a Newly Developed Immersion Tin Coating

A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference
Latest Publications