2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications

TOTAL DOCUMENTS

124

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

9781424433926

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Addressing industry knowledge gaps regarding new Pb-free solder alloy alternatives

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507794 ◽

2008 ◽

Author(s):

Gregory Henshall ◽

Robert Healey ◽

Ranjit S. Pandher ◽

Keith Sweatman ◽

Keith Howell ◽

...

Keyword(s):

Solder Alloy ◽

Knowledge Gaps ◽

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Modeling and process development of Die Edge Protection to alleviate thermo-mechanical stresses on silicon dies in PBGA packages

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507839 ◽

2008 ◽

Author(s):

C.S. Foong ◽

K.W. Shim ◽

Min Ding

Keyword(s):

Process Development ◽

Mechanical Stresses

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A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507840 ◽

2008 ◽

Author(s):

Eu Poh Leng ◽

Min Ding ◽

Wong Tzu Ling ◽

Nowshad Amin ◽

Ibrahim Ahmad ◽

...

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Comparison Study ◽

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Low temperature electromigration and thermomigration in lead-free solder joints

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507782 ◽

2008 ◽

Author(s):

Mohd Foad Abdul Hamid ◽

Cemal Basaran

Keyword(s):

Low Temperature ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

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Important qualification process to wafer probing

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507868 ◽

2008 ◽

Author(s):

Yoon-Peng Yee

Keyword(s):

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Variability modeling of RF characteristics for multi-finger MOSFETs using statistical methods

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507890 ◽

2008 ◽

Author(s):

Hyuck Sang Yim ◽

Jung Han Kang ◽

Ilgu Yun

Keyword(s):

Statistical Methods ◽

Variability Modeling

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The effect of STI and active length on dual gate oxide reliability

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507827 ◽

2008 ◽

Author(s):

Ng Hong Seng

Keyword(s):

Active Length ◽

Oxide Reliability ◽

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Characterization of copper etching process on micro leadless land grid array (ゼLLGA) via design of experiments approach

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507844 ◽

2008 ◽

Author(s):

Bih Wen Fon ◽

Hou Boon Tan ◽

Kok Kee Yang

Keyword(s):

Design Of Experiments ◽

Etching Process

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Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507785 ◽

2008 ◽

Author(s):

Victor Lim ◽

Ibrahim Ahmad ◽

Foong Chee Seng ◽

Nowshad Amin ◽

Rozaidi Rasid

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Catalytic Activation ◽

Heat Spreaders ◽

Ball Grid Array Package

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Embedded Wafer Level Ball Grid Array (eWLB)

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507866 ◽

2008 ◽

Author(s):

M. Brunnbauer ◽

T. Meyer ◽

G. Ofner ◽

K. Mueller ◽

R. Hagen

Keyword(s):

Ball Grid Array ◽

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