2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications

TOTAL DOCUMENTS

124

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424433926

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The effect of STI and active length on dual gate oxide reliability

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507827 ◽

2008 ◽

Author(s):

Ng Hong Seng

Keyword(s):

Gate Oxide ◽

Active Length ◽

Oxide Reliability ◽

Dual Gate

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Characterization of copper etching process on micro leadless land grid array (ゼLLGA) via design of experiments approach

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507844 ◽

2008 ◽

Author(s):

Bih Wen Fon ◽

Hou Boon Tan ◽

Kok Kee Yang

Keyword(s):

Design Of Experiments ◽

Etching Process

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Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507785 ◽

2008 ◽

Author(s):

Victor Lim ◽

Ibrahim Ahmad ◽

Foong Chee Seng ◽

Nowshad Amin ◽

Rozaidi Rasid

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Catalytic Activation ◽

Heat Spreaders ◽

Ball Grid Array Package

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Embedded Wafer Level Ball Grid Array (eWLB)

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507866 ◽

2008 ◽

Cited By ~ 36

Author(s):

M. Brunnbauer ◽

T. Meyer ◽

G. Ofner ◽

K. Mueller ◽

R. Hagen

Keyword(s):

Ball Grid Array ◽

Wafer Level

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Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507801 ◽

2008 ◽

Cited By ~ 4

Author(s):

R. Durairaj ◽

S. Mallik ◽

A. Seman ◽

A. Marks ◽

N.N. Ekere

Keyword(s):

Viscoelastic Properties ◽

Flip Chip ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives ◽

Solder Pastes ◽

Flip Chip Assembly

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Effective method to simulate Crosstalk between high density IO traces in high performance FPGA packages

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507842 ◽

2008 ◽

Author(s):

Wai Ling Lee ◽

Hoon Ngik Low ◽

Hong Shi

Keyword(s):

High Performance ◽

High Density

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Variability modeling of RF characteristics for multi-finger MOSFETs using statistical methods

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507890 ◽

2008 ◽

Author(s):

Hyuck Sang Yim ◽

Jung Han Kang ◽

Ilgu Yun

Keyword(s):

Statistical Methods ◽

Variability Modeling

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Addressing industry knowledge gaps regarding new Pb-free solder alloy alternatives

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507794 ◽

2008 ◽

Cited By ~ 4

Author(s):

Gregory Henshall ◽

Robert Healey ◽

Ranjit S. Pandher ◽

Keith Sweatman ◽

Keith Howell ◽

...

Keyword(s):

Solder Alloy ◽

Knowledge Gaps ◽

Free Solder

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Modeling and process development of Die Edge Protection to alleviate thermo-mechanical stresses on silicon dies in PBGA packages

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507839 ◽

2008 ◽

Author(s):

C.S. Foong ◽

K.W. Shim ◽

Min Ding

Keyword(s):

Process Development ◽

Mechanical Stresses

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A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507840 ◽

2008 ◽

Author(s):

Eu Poh Leng ◽

Min Ding ◽

Wong Tzu Ling ◽

Nowshad Amin ◽

Ibrahim Ahmad ◽

...

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Comparison Study ◽

Free Solder

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2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

The effect of STI and active length on dual gate oxide reliability

Characterization of copper etching process on micro leadless land grid array (ゼLLGA) via design of experiments approach

Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

Embedded Wafer Level Ball Grid Array (eWLB)

Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Effective method to simulate Crosstalk between high density IO traces in high performance FPGA packages

Variability modeling of RF characteristics for multi-finger MOSFETs using statistical methods

Addressing industry knowledge gaps regarding new Pb-free solder alloy alternatives

Modeling and process development of Die Edge Protection to alleviate thermo-mechanical stresses on silicon dies in PBGA packages

A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications