Development of a finite-element-model for transient thermal analysis of thermal cycle tests on stator bars for large rotating machines

2012 ◽  
Author(s):  
Christian Staubach ◽  
Christian Foelting ◽  
Amir Taghipour Anvari ◽  
Frank Janau
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Finite Element Model ◽  
Thermal Cycle ◽  
Element Model ◽  
Rotating Machines ◽  
Transient Thermal Analysis ◽  
Transient Thermal

Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000028-000031 ◽  
Author(s):  
Fumiki Kato ◽  
Hiroki Takahashi ◽  
Hidekazu Tanisawa ◽  
Kenichi Koui ◽  
Shinji Sato ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Thermal Resistance ◽  
Thermal Cycle ◽  
Base Plate ◽  
Test Machine ◽  
Power Module ◽  
Eutectic Solder ◽  
Transient Thermal Analysis ◽  
The Individual ◽  
Transient Thermal

Abstract In this paper, we demonstrate that the structural degradation of a silicon carbide (SiC) power module corresponding to thermal cycles can be detected and tracked non-destructively by transient thermal analysis method. The purpose of this evaluation is to analyze the distribution of the thermal resistance in the power module and to identify the structure deterioration part. The power module with SiC-MOSFET were assembled using ZnAl eutectic solder as device under test. The individual thermal resistance of each part such as the SiC-die, the die-attachment, the AMCs, and the baseplate was successfully evaluated by analyzing the structure function graph. A series of thermal cycle test between −40 and 250°C was conducted, and the power modules were evaluated their thermal resistance taken out from thermal cycle test machine at 100, 200, 500 and 1000 cycles. We confirmed the increase in thermal resistance between AMCs and base plate in each thermal cycle. The portion where the thermal resistance increased is in good agreement with the location of the structural defect observed by scanning acoustic tomography (SAT) observation.

Thermal Analysis of a Satellite Borne Instrument

2014 ◽  
Vol 536-537 ◽  
pp. 1397-1400
Author(s):  
Bo Chen ◽  
Ning Li
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Finite Element Model ◽  
Element Model ◽  
Thermal Design

Thermal design and analysis of a satellite instrument is introduced in this paper. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results showed that the temperature scopes of the main structures are from 45°C to 65.8°C and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.

Residual Stresses and Deformations in Electron Beam Melting process Using Finite Element Analysis

2012 ◽  
Vol 576 ◽  
pp. 789-792 ◽  
Author(s):  
Afshin Mohammad Hosseini ◽  
Syed H. Masood ◽  
Darren Fraser ◽  
Mahnaz Jahedi
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Electron Beam ◽  
Structural Analysis ◽  
Residual Stresses ◽  
Electron Beam Melting ◽  
Process Conditions ◽  
Measured Temperature ◽  
Transient Thermal Analysis ◽  
Transient Thermal

The simulation of residual stress in Electron Beam Melting (EBM) process is critical for optimization of process conditions. However, there is no published literature on the simulation of residual stresses in this process. This paper considers finite element modeling of the temperature distribution through transient thermal analysis. The measured temperature and total heat flux from transient thermal analysis are then used as initial input parameters to the structural analysis. Consequently, deformations and residual stresses in structural analysis were measured. The titanium alloy, Ti6Al4V has been used, which is one of the most common materials for biomedical implants due to its high strength to weight ratio, corrosion resistance, and its biocompatibility features.

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