Thermal Analysis of a Satellite Borne Instrument
2014 ◽
Vol 536-537
◽
pp. 1397-1400
Keyword(s):
Thermal design and analysis of a satellite instrument is introduced in this paper. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results showed that the temperature scopes of the main structures are from 45°C to 65.8°C and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.
Keyword(s):
2012 ◽
Vol 11
(1)
◽
Keyword(s):
2013 ◽
Vol 655-657
◽
pp. 84-87
◽
1988 ◽
2009 ◽
Vol 23
(6)
◽
pp. 1123-1126
Keyword(s):
2014 ◽
Vol 651-653
◽
pp. 1287-1291
Keyword(s):
2019 ◽
Vol 890
◽
pp. 155-161