Partial thermal impedance measurement for die interconnection characterization by a microsecond “pulsed heating curve technique”

2013 ◽  
Author(s):  
B. Thollin ◽  
L. Dupont ◽  
Z. Khatir ◽  
Y. Avenas ◽  
J. C. Crebier ◽  
...  
Keyword(s):  
Impedance Measurement ◽  
Thermal Impedance ◽  
Heating Curve ◽  
Pulsed Heating

Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization

2016 ◽  
Vol 6 (6) ◽  
pp. 835-845 ◽  
Author(s):  
Benoit Thollin ◽  
Laurent Dupont ◽  
Yvan Avenas ◽  
Jean-Christophe Crebier ◽  
Zoubir Khatir ◽  
...  
Keyword(s):  
Experimental Evaluation ◽  
Heating Curve ◽  
Pulsed Heating

Thermal impedance measurement of integrated inductors on bulk silicon substrate

2017 ◽  
Vol 73 ◽  
pp. 54-59 ◽  
Author(s):  
M. Kałuża ◽  
B. Więcek ◽  
G. De Mey ◽  
A. Hatzopoulos ◽  
V. Chatziathanasiou
Keyword(s):  
Silicon Substrate ◽  
Impedance Measurement ◽  
Thermal Impedance ◽  
Bulk Silicon ◽  
Integrated Inductors

Thermal impedance measurement of semiconductor lasers

1994 ◽  
Vol 30 (10) ◽  
pp. 793-794 ◽  
Author(s):  
B. S. Bhumbra ◽  
A. P. Wright ◽  
G. H. B. Thompson
Keyword(s):  
Semiconductor Lasers ◽  
Impedance Measurement ◽  
Thermal Impedance
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