A Novel Method to Study Strain-induced Delamination in Plastic IC Packages using an Digital Image Correlation Tool
2020 ◽
Vol 126
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pp. 105907
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2020 ◽
Vol 187
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pp. 106806
2012 ◽
Vol 53
(5)
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pp. 755-765
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2018 ◽
Vol 885
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pp. 304-310
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2018 ◽
Vol 166
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pp. 482-489
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2018 ◽
Vol 204
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pp. 185-197
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2018 ◽
Vol 100
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pp. 259-266
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