Thermo-mechanical properties of Isotropic Conductive Adhesive filled with Metallized Polymer Spheres

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745715 ◽

2013 ◽

Author(s):

Jakob Gakkestad ◽

Zhuo Li ◽

Tore Helland ◽

C. P. Wong

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Isotropic Conductive Adhesive ◽

Metallized Polymer ◽

Polymer Spheres

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Isotropic conductive adhesive filled with metal-coated polymer spheres — Effects of metal coating on rheological and mechanical properties

2012 4th Electronic System-Integration Technology Conference ◽

10.1109/estc.2012.6542147 ◽

2012 ◽

Author(s):

Hoang-Vu Nguyen ◽

Helge Kristiansen ◽

Rolf Johannessen ◽

Erik Andreassen ◽

Nils Hoivik ◽

...

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Metal Coating ◽

Isotropic Conductive Adhesive ◽

Polymer Spheres

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Temperature dependence of mechanical properties of isotropic conductive adhesive filled with metal coated polymer spheres

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898580 ◽

2011 ◽

Author(s):

Hoang-Vu Nguyen ◽

Helge Kristiansen ◽

Rolf Johannessen ◽

Erik Andreassen ◽

Andreas Larsson ◽

...

Keyword(s):

Mechanical Properties ◽

Temperature Dependence ◽

Conductive Adhesive ◽

Isotropic Conductive Adhesive ◽

Polymer Spheres

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Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2013.2259166 ◽

2013 ◽

Vol 3 (7) ◽

pp. 1084-1093 ◽

Author(s):

Hoang-Vu Nguyen ◽

Erik Andreassen ◽

Helge Kristiansen ◽

Knut E. Aasmundtveit

Keyword(s):

Conductive Adhesive ◽

Shear Testing ◽

Isotropic Conductive Adhesive ◽

Polymer Spheres ◽

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WITHDRAWN: Strain rate and temperature effects on the mechanical properties of cured isotropic conductive adhesive (ICA) at micro scale

Mechanics of Materials ◽

10.1016/j.mechmat.2018.03.004 ◽

2018 ◽

Author(s):

Gesheng Xiao ◽

Zhigang Li ◽

Erqiang Liu ◽

Li Qiao ◽

Xuexia Yang ◽

...

Keyword(s):

Mechanical Properties ◽

Strain Rate ◽

Temperature Effects ◽

Conductive Adhesive ◽

Micro Scale ◽

Isotropic Conductive Adhesive

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The effect of nano fillers in electrical and mechanical properties of isotropic conductive adhesive

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123070 ◽

2014 ◽

Author(s):

C. S. Chew ◽

R. Durairaj ◽

J. Hwang ◽

J Tan ◽

M. S. Liang ◽

...

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Isotropic Conductive Adhesive

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Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation

International Journal of Solids and Structures ◽

10.1016/j.ijsolstr.2017.06.003 ◽

2017 ◽

Vol 122-123 ◽

pp. 81-90 ◽

Author(s):

Gesheng Xiao ◽

Erqiang Liu ◽

Tao Jin ◽

Xuefeng Shu ◽

Zhihua Wang ◽

...

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Hygrothermal Aging ◽

Isotropic Conductive Adhesive ◽

Micro Indentation

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Microscale mechanical properties dependent on the strain rate and temperature of cured isotropic conductive adhesive

Mechanics of Time-Dependent Materials ◽

10.1007/s11043-019-09438-9 ◽

2019 ◽

Author(s):

Gesheng Xiao ◽

Zhigang Li ◽

Erqiang Liu ◽

Li Qiao ◽

Xuefeng Shu ◽

...

Keyword(s):

Mechanical Properties ◽

Strain Rate ◽

Conductive Adhesive ◽

Isotropic Conductive Adhesive

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Rheological characterization of a novel isotropic conductive adhesive – Epoxy filled with metal-coated polymer spheres

Materials & Design (1980-2015) ◽

10.1016/j.matdes.2012.11.036 ◽

2013 ◽

Vol 46 ◽

pp. 784-793 ◽

Author(s):

Hoang-Vu Nguyen ◽

Erik Andreassen ◽

Helge Kristiansen ◽

Rolf Johannessen ◽

Nils Hoivik ◽

...

Keyword(s):

Conductive Adhesive ◽

Rheological Characterization ◽

Isotropic Conductive Adhesive ◽

Polymer Spheres ◽

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Characterisation of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973307 ◽

2002 ◽

Author(s):

H. Kristiansen ◽

Yuanliang Shen ◽

J. Liu

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Polymer Spheres

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Characterization of mechanical properties of metalcoated polymer spheres for anisotropic conductive adhesive

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432077 ◽

2005 ◽

Author(s):

H. Kristiansen ◽

Z.L. Zhang ◽

J. Liu

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Polymer Spheres

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