36th International Electronics Manufacturing Technology Conference
Latest Publications

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Published By IEEE

9781479982097

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Title: Next level of productivity through capillary life extension with automatic capillary cleaning

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123091 ◽

2014 ◽

Author(s):

Sivalingam Thevan ◽

Koh Feng Choon

Keyword(s):

Life Extension

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Effect of microwave hybrid heating on the formation of intermetallic compound of Sn-Ag-Cu solder joints

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123094 ◽

2014 ◽

Cited By ~ 1

Author(s):

Maisarah Lutfi ◽

Farazila Yusof ◽

S. Ramesh ◽

T. Ariga ◽

M. Hamdi

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Hybrid Heating ◽

Microwave Hybrid Heating

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Ultrasonic solder writing, the next level die attach process

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123095 ◽

2014 ◽

Author(s):

Lim Fong ◽

Tay Chiong Yong ◽

Goh Zhi Yuan ◽

Charles Galea ◽

Heinrich Berchtold

Keyword(s):

Die Attach

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Assessment of high temperature, lead free paste alternatives for semiconductor packaging

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123078 ◽

2014 ◽

Author(s):

G P Neoh ◽

K C Thong ◽

Lily Khor

Keyword(s):

High Temperature ◽

Lead Free ◽

Semiconductor Packaging

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Challenges of ultimate ultra-fine pitch process with gold wire & copper wire in QFN packages

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123107 ◽

2014 ◽

Author(s):

C. E. Tan ◽

J. Y. Liong ◽

Jeramie Dimatira ◽

Jason Tan ◽

Lee Wee Kok

Keyword(s):

Copper Wire ◽

Gold Wire ◽

Fine Pitch

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Design and optimization of package inductor for efficient power rail merger

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123103 ◽

2014 ◽

Cited By ~ 1

Author(s):

Fern Nee Tan

Keyword(s):

Design And Optimization ◽

Efficient Power

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Low cost & high quality copper wire bonding in increasing market growth

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123108 ◽

2014 ◽

Cited By ~ 2

Author(s):

C. E. Tan

Keyword(s):

Copper Wire ◽

Low Cost ◽

Wire Bonding ◽

High Quality ◽

Market Growth ◽

Copper Wire Bonding

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Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123119 ◽

2014 ◽

Cited By ~ 3

Author(s):

S. T. Chua ◽

K. S. Siow ◽

A. Jalar

Keyword(s):

Shear Properties ◽

Sintering Atmosphere ◽

Sintered Silver

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Methodology to improve the die singulation quality for low-k and high TEG saw street wafer

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123087 ◽

2014 ◽

Cited By ~ 1

Author(s):

Lam Kok Meng ◽

Yong Tack Chee ◽

Yudho Prasetyo

Keyword(s):

Low K

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Analyzing package-on-package (PoP) reflow assembly interfaces with interconnect gap analysis

36th International Electronics Manufacturing Technology Conference ◽

10.1109/iemt.2014.7123136 ◽

2014 ◽

Cited By ~ 2

Author(s):

Ken Chiavone

Keyword(s):

Gap Analysis

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36th International Electronics Manufacturing Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Title: Next level of productivity through capillary life extension with automatic capillary cleaning

Effect of microwave hybrid heating on the formation of intermetallic compound of Sn-Ag-Cu solder joints

Ultrasonic solder writing, the next level die attach process

Assessment of high temperature, lead free paste alternatives for semiconductor packaging

Challenges of ultimate ultra-fine pitch process with gold wire & copper wire in QFN packages

Design and optimization of package inductor for efficient power rail merger

Low cost & high quality copper wire bonding in increasing market growth

Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

Methodology to improve the die singulation quality for low-k and high TEG saw street wafer

Analyzing package-on-package (PoP) reflow assembly interfaces with interconnect gap analysis

36th International Electronics Manufacturing Technology Conference
Latest Publications