Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432074 ◽

2005 ◽

Cited By ~ 2

Author(s):

Myung Jin Yim ◽

Jinsang Hwang ◽

Kyung Wook Paik

Keyword(s):

Conductive Films ◽

Fine Pitch

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An AlN-based high temperature package for SiC devices: materials and processing

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432068 ◽

2005 ◽

Cited By ~ 1

Author(s):

Zhigang Lin ◽

R.J. Yoon

Keyword(s):

High Temperature

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Effect of electromigration on mechanical behavior of solder joints

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432048 ◽

2005 ◽

Cited By ~ 6

Author(s):

F. Ren ◽

J.W. Nah ◽

J.O. Suh ◽

K.N. Tu ◽

B.S. Xiong ◽

...

Keyword(s):

Mechanical Behavior ◽

Solder Joints

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Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432062 ◽

2005 ◽

Cited By ~ 2

Author(s):

A. Drost ◽

G. Klink ◽

M. Feil ◽

K. Bock

Keyword(s):

Electronic Systems ◽

Flexible Electronic ◽

Fine Pitch

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Electrical contact resistance of silver with different coatings

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432050 ◽

2005 ◽

Author(s):

Bin Su ◽

Jianmin Qu

Keyword(s):

Contact Resistance ◽

Electrical Contact ◽

Electrical Contact Resistance

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Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432076 ◽

2005 ◽

Cited By ~ 6

Author(s):

J. Liu ◽

Y. Wang ◽

J. Morris ◽

H. Kristiansen

Keyword(s):

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Interconnect Technology

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Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432072 ◽

2005 ◽

Cited By ~ 10

Author(s):

Hongjin Jiang ◽

Kyoung-sik Moon ◽

C.P. Wong

Keyword(s):

Lead Free ◽

Alloy Nanoparticles ◽

Cu Alloy

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Process optimization of lead-free wafer-level underfill material used in chip scale packaging

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432092 ◽

2005 ◽

Author(s):

Yayun Liu ◽

Gyan Dutt ◽

A. Xiao ◽

R. Chaware ◽

M. Francis

Keyword(s):

Process Optimization ◽

Lead Free ◽

Wafer Level ◽

Underfill Material

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The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432087 ◽

2005 ◽

Cited By ~ 4

Author(s):

Hongjin Jiang ◽

Kyoung-sik Moon ◽

Lingbo Zhu ◽

Jiongxin Lu ◽

C.P. Wong

Keyword(s):

Ag Nanoparticles ◽

Self Assembled Monolayer ◽

Self Assembled

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Constitutive modeling of lead-free solders

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432043 ◽

2005 ◽

Cited By ~ 31

Author(s):

M. Pei ◽

J. Qu

Keyword(s):

Constitutive Modeling ◽

Lead Free ◽

Lead Free Solders

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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

An AlN-based high temperature package for SiC devices: materials and processing

Effect of electromigration on mechanical behavior of solder joints

Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Electrical contact resistance of silver with different coatings

Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Process optimization of lead-free wafer-level underfill material used in chip scale packaging

The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite

Constitutive modeling of lead-free solders

Export Citation Format

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

An AlN-based high temperature package for SiC devices: materials and processing

Effect of electromigration on mechanical behavior of solder joints

Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Electrical contact resistance of silver with different coatings

Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Process optimization of lead-free wafer-level underfill material used in chip scale packaging

The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite

Constitutive modeling of lead-free solders

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
Latest Publications