Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

2005 ◽

Cited By ~ 6

Author(s):

F. Ren ◽

J.W. Nah ◽

J.O. Suh ◽

K.N. Tu ◽

B.S. Xiong ◽

...

Keyword(s):

Mechanical Behavior ◽

Solder Joints

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Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432062 ◽

2005 ◽

Cited By ~ 2

Author(s):

A. Drost ◽

G. Klink ◽

M. Feil ◽

K. Bock

Keyword(s):

Electronic Systems ◽

Flexible Electronic ◽

Fine Pitch

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Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432074 ◽

2005 ◽

Cited By ~ 2

Author(s):

Myung Jin Yim ◽

Jinsang Hwang ◽

Kyung Wook Paik

Keyword(s):

Conductive Films ◽

Fine Pitch

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An AlN-based high temperature package for SiC devices: materials and processing

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432068 ◽

2005 ◽

Cited By ~ 1

Author(s):

Zhigang Lin ◽

R.J. Yoon

Keyword(s):

High Temperature

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Electrical contact resistance of silver with different coatings

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432050 ◽

2005 ◽

Author(s):

Bin Su ◽

Jianmin Qu

Keyword(s):

Contact Resistance ◽

Electrical Contact ◽

Electrical Contact Resistance

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Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432076 ◽

2005 ◽

Cited By ~ 6

Author(s):

J. Liu ◽

Y. Wang ◽

J. Morris ◽

H. Kristiansen

Keyword(s):

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Interconnect Technology

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Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432072 ◽

2005 ◽

Cited By ~ 10

Author(s):

Hongjin Jiang ◽

Kyoung-sik Moon ◽

C.P. Wong

Keyword(s):

Lead Free ◽

Alloy Nanoparticles ◽

Cu Alloy

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Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432073 ◽

2005 ◽

Author(s):

A.T. Wu ◽

J.R. Lloyd ◽

N. Tamura ◽

K.N. Tu

Keyword(s):

Microstructure Evolution ◽

X Ray

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Comparative studies of green molding compounds for the encapsulation of Cu/low-k packages

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432091 ◽

2005 ◽

Cited By ~ 1

Author(s):

S. Chungpaiboonpatana ◽

F.G. Shi ◽

M. Todd ◽

L. Crane

Keyword(s):

Comparative Studies ◽

Molding Compounds ◽

Low K

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Utilization of carbon fibers in thermal management of microelectronics

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432086 ◽

2005 ◽

Cited By ~ 2

Author(s):

H.A. Zhong ◽

S. Rubinsztajn ◽

A. Gowda ◽

D. Esler ◽

D. Gibson ◽

...

Keyword(s):

Thermal Management ◽

Carbon Fibers

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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of electromigration on mechanical behavior of solder joints

Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

An AlN-based high temperature package for SiC devices: materials and processing

Electrical contact resistance of silver with different coatings

Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction

Comparative studies of green molding compounds for the encapsulation of Cu/low-k packages

Utilization of carbon fibers in thermal management of microelectronics

Export Citation Format

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of electromigration on mechanical behavior of solder joints

Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

An AlN-based high temperature package for SiC devices: materials and processing

Electrical contact resistance of silver with different coatings

Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications

Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction

Comparative studies of green molding compounds for the encapsulation of Cu/low-k packages

Utilization of carbon fibers in thermal management of microelectronics

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
Latest Publications