2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

351

(FIVE YEARS 0)

H-INDEX

21

(FIVE YEARS 0)

Published By IEEE

9781612844978

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

An accurate and fast 3D numerical approach to power/signal and thermal co-simulation

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898555 ◽

2011 ◽

Author(s):

Xin Ai ◽

An-Yu Kuo ◽

Mazen Baida ◽

Yun Chase

Keyword(s):

Numerical Approach

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Interrogation of accrued damage and remaining life in field-deployed electronics subjected to multiple thermal environments of thermal aging and thermal cycling

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898600 ◽

2011 ◽

Author(s):

Pradeep Lall ◽

Mahendra Harsha ◽

Krishan Kumar ◽

Kai Goebel ◽

Jim Jones ◽

...

Keyword(s):

Thermal Cycling ◽

Thermal Aging ◽

Remaining Life ◽

Thermal Environments

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Phenomenological understanding of Sn migration in ceramic-chip capacitors

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898564 ◽

2011 ◽

Author(s):

Arun Raman ◽

Shubhada Sahasrabudhe ◽

Lyndell Dietz ◽

Mohammad Hossain

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TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898608 ◽

2011 ◽

Author(s):

K. Zoschke ◽

J. Wolf ◽

C. Lopper ◽

I. Kuna ◽

N. Jurgensen ◽

...

Keyword(s):

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Electrical and aging characterization of organic capacitive substrate

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898759 ◽

2011 ◽

Author(s):

Yun-Tien Chen ◽

Shur-Fen Liu ◽

Chin-Hsien Hung ◽

Meng-Huei Chen ◽

Wei-Hsuan Wang

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Lithography technique to reduce the alignment errors from die placement in fan-out wafer level packaging applications

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898493 ◽

2011 ◽

Author(s):

Warren Flack ◽

Robert Hsieh ◽

Gareth Kenyon ◽

Khiem Nguyen ◽

Manish Ranjan ◽

...

Keyword(s):

Wafer Level ◽

Wafer Level Packaging ◽

Alignment Errors ◽

Lithography Technique

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Integrated balun bandpass filter design with an optimal common mode rejection ratio

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898504 ◽

2011 ◽

Author(s):

Chien-Hsun Chen ◽

Chien-Hsiang Huang ◽

Tzyy-Sheng Horng ◽

Sung-Mao Wu ◽

Jian-Yu Li ◽

...

Keyword(s):

Bandpass Filter ◽

Filter Design ◽

Common Mode ◽

Common Mode Rejection Ratio ◽

Rejection Ratio

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Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898483 ◽

2011 ◽

Author(s):

K. Sakuma ◽

K. Toriyama ◽

H. Noma ◽

K. Sueoka ◽

N. Unami ◽

...

Keyword(s):

Fluxless Bonding ◽

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Nano and micro materials in a Pb-free world

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898667 ◽

2011 ◽

Author(s):

Rabindra N. Das ◽

John M. Lauffer ◽

Kevin Knadle ◽

Michael Vincent ◽

Mark D. Poliks ◽

...

Keyword(s):

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A manufacturing approach to reducing underfill voiding on large die (> 18 mm) flip chip organic laminate packaging

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898635 ◽

2011 ◽

Author(s):

Isabel de Sousa ◽

Luc Belanger ◽

Catherine Dufort ◽

Simon Dl Chenier

Keyword(s):

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