2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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9781612844978
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Design and characterization of power delivery system for multi-chip package with embedded discrete capacitors

2011 ◽  
Author(s):  
Hung-Hsiang Cheng ◽  
Chih-Wen Kuo ◽  
Po-Chih Pan ◽  
Yi-Hua Chen ◽  
Kuo-Hua Chen ◽  
...  
Keyword(s):  
Delivery System ◽  
Power Delivery

Investigations of the water-borne isotropically conductive adhesives

2011 ◽  
Author(s):  
Cheng Yang ◽  
Matthew M F Yuen ◽  
Guohua Chen ◽  
Zhongyu Li ◽  
C P Wong
Keyword(s):  
Conductive Adhesives ◽  
Water Borne

Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

2011 ◽  
Author(s):  
Yu-Min Lin ◽  
Chau-Jie Zhan ◽  
Jing-Ye Juang ◽  
John H. Lau ◽  
Tai-Hong Chen ◽  
...  
Keyword(s):  
3D Ic

Effect of Sn grain structure on electromigration reliability of Pb-free solders

2011 ◽  
Author(s):  
Yiwei Wang ◽  
Kuan H. Lu ◽  
Vikas Gupta ◽  
Leon Stiborek ◽  
Dwayne Shirley ◽  
...  
Keyword(s):  
Grain Structure

Thin-core MCM assembly development for high-performance server microprocessor

2011 ◽  
Author(s):  
Sean S. Too ◽  
Mohammad Khan ◽  
Kevin Lim ◽  
Mike Loo ◽  
W C Lau ◽  
...  
Keyword(s):  
High Performance
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