anisotropic conductive adhesive Latest Research Papers

Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging

10.1109/icept52650.2021.9568173 ◽

2021 ◽

Author(s):

Gui Chen ◽

Yan Wang ◽

Xiaoyu Xiao ◽

Yamei Yan ◽

Wenhui Zhu

Keyword(s):

Failure Analysis ◽

Flip Chip ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Flip Chip Packaging

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Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229750 ◽

2020 ◽

Author(s):

Hoang-Vu Nguyen ◽

Helge Kristiansen ◽

Kristin Imenes ◽

Knut E. Aasmundtveit

Keyword(s):

Medical Devices ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Peel Adhesion

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Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive

Journal of Welding and Joining ◽

10.5781/jwj.2020.38.2.4 ◽

2020 ◽

Cited By ~ 1

Author(s):

Byung-Seung Yim ◽

Hee Jun Youn ◽

Jeong Il Lee ◽

Jong-Min Kim

Keyword(s):

Carbon Nanotube ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

ECS Transactions ◽

10.1149/1.3360717 ◽

2019 ◽

Vol 27 (1) ◽

pp. 825-830

Author(s):

Xia Zhang ◽

Teng Wang ◽

Pär Berggren ◽

Si Chen ◽

Johan Liu

Keyword(s):

Carbon Nanotube ◽

Flip Chip ◽

Conductive Adhesive ◽

Adhesive Film ◽

Anisotropic Conductive Adhesive ◽

Flip Chip Assembly

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Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951801 ◽

2019 ◽

Cited By ~ 1

Author(s):

Hoang-Vu Nguyen ◽

Helge Kristiansen ◽

Anders Lifjeld ◽

Kristin Imenes ◽

Knut E. Aasmundtveit

Keyword(s):

Medical Devices ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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In Vitro Reactive-Accelerated-Aging Assessment of Anisotropic Conductive Adhesive and Back-End Packaging for Electronic Neural Interfaces

2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) ◽

10.1109/embc.2019.8856692 ◽

2019 ◽

Author(s):

Cary A. Kuliasha ◽

Jack W. Judy

Keyword(s):

Accelerated Aging ◽

Conductive Adhesive ◽

Neural Interfaces ◽

Anisotropic Conductive Adhesive

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Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive

IEEE Access ◽

10.1109/access.2019.2956648 ◽

2019 ◽

Vol 7 ◽

pp. 171923-171933

Author(s):

Guanghua Wu ◽

Meixian Jiang

Keyword(s):

Residual Stress ◽

Flip Chip ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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The Application of Anisotropic Conductive Adhesive in Broadband Microwave Interconnections

2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) ◽

10.1109/icmmt.2018.8563897 ◽

2018 ◽

Author(s):

Mingxiao Zhao ◽

Hui Wang ◽

Le Dong

Keyword(s):

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Influence of Metallization and Size on the Conductive Properties of Metal-Coated Polymer Particles in Anisotropic Conductive Adhesive

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00287 ◽

2018 ◽

Author(s):

Molly Bazilchuk ◽

Helge Kristiansen ◽

Jianying He

Keyword(s):

Conductive Adhesive ◽

Polymer Particles ◽

Anisotropic Conductive Adhesive ◽

Conductive Properties

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Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

2017 IEEE International Ultrasonics Symposium (IUS) ◽

10.1109/ultsym.2017.8092114 ◽

2017 ◽

Author(s):

Gerard Cummins ◽

Jun Gao ◽

Rachael McPhillips ◽

David Watson ◽

Sandy Cochran ◽

...

Keyword(s):

Piezoelectric Transducers ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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anisotropic conductive adhesive
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging

Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices

Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive

Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices

In Vitro Reactive-Accelerated-Aging Assessment of Anisotropic Conductive Adhesive and Back-End Packaging for Electronic Neural Interfaces

Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive

The Application of Anisotropic Conductive Adhesive in Broadband Microwave Interconnections

Influence of Metallization and Size on the Conductive Properties of Metal-Coated Polymer Particles in Anisotropic Conductive Adhesive

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

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anisotropic conductive adhesiveRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging

Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices

Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive

Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices

In Vitro Reactive-Accelerated-Aging Assessment of Anisotropic Conductive Adhesive and Back-End Packaging for Electronic Neural Interfaces

Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive

The Application of Anisotropic Conductive Adhesive in Broadband Microwave Interconnections

Influence of Metallization and Size on the Conductive Properties of Metal-Coated Polymer Particles in Anisotropic Conductive Adhesive

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

anisotropic conductive adhesive
Recently Published Documents