anisotropic conductive adhesive Recently Published Documents

Flip Chip Packaging

Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229750 ◽

2020 ◽

Author(s):

Hoang-Vu Nguyen ◽

Helge Kristiansen ◽

Kristin Imenes ◽

Knut E. Aasmundtveit

Keyword(s):

Medical Devices ◽

Conductive Adhesive ◽

Peel Adhesion

Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive

Journal of Welding and Joining ◽

10.5781/jwj.2020.38.2.4 ◽

2020 ◽

Cited By ~ 1

Author(s):

Byung-Seung Yim ◽

Hee Jun Youn ◽

Jeong Il Lee ◽

Jong-Min Kim

Keyword(s):

Carbon Nanotube ◽

Conductive Adhesive ◽

Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

ECS Transactions ◽

10.1149/1.3360717 ◽

2019 ◽

Vol 27 (1) ◽

pp. 825-830

Author(s):

Xia Zhang ◽

Teng Wang ◽

Pär Berggren ◽

Si Chen ◽

Johan Liu

Keyword(s):

Carbon Nanotube ◽

Flip Chip ◽

Conductive Adhesive ◽

Adhesive Film ◽

Flip Chip Assembly

Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951801 ◽

2019 ◽

Cited By ~ 1

Author(s):

Hoang-Vu Nguyen ◽

Helge Kristiansen ◽

Anders Lifjeld ◽

Kristin Imenes ◽

Knut E. Aasmundtveit

Keyword(s):

Medical Devices ◽

Conductive Adhesive ◽

2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) ◽

In Vitro Reactive-Accelerated-Aging Assessment of Anisotropic Conductive Adhesive and Back-End Packaging for Electronic Neural Interfaces

10.1109/embc.2019.8856692 ◽

2019 ◽

Author(s):

Cary A. Kuliasha ◽

Jack W. Judy

Keyword(s):

Accelerated Aging ◽

Conductive Adhesive ◽

Neural Interfaces ◽

Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive

IEEE Access ◽

10.1109/access.2019.2956648 ◽

2019 ◽

Vol 7 ◽

pp. 171923-171933

Author(s):

Guanghua Wu ◽

Meixian Jiang

Keyword(s):

Residual Stress ◽

Flip Chip ◽

Conductive Adhesive ◽

2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) ◽

The Application of Anisotropic Conductive Adhesive in Broadband Microwave Interconnections

10.1109/icmmt.2018.8563897 ◽

2018 ◽

Author(s):

Mingxiao Zhao ◽

Hui Wang ◽

Le Dong

Keyword(s):

Conductive Adhesive ◽

Influence of Metallization and Size on the Conductive Properties of Metal-Coated Polymer Particles in Anisotropic Conductive Adhesive

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00287 ◽

2018 ◽

Author(s):

Molly Bazilchuk ◽

Helge Kristiansen ◽

Jianying He

Keyword(s):

Conductive Adhesive ◽

Polymer Particles ◽

Conductive Properties

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

2017 IEEE International Ultrasonics Symposium (IUS) ◽

10.1109/ultsym.2017.8092114 ◽

2017 ◽

Author(s):

Gerard Cummins ◽

Jun Gao ◽

Rachael McPhillips ◽

David Watson ◽

Sandy Cochran ◽

...

Keyword(s):

Piezoelectric Transducers ◽

Conductive Adhesive ◽