Impedance Characterization of Power Delivery Network in a Flip Chip Package on a Printed Circuit Board

Author(s):  
Low Suat-Mooi ◽  
Guo Fei ◽  
Wong Wui-Weng
2019 ◽  
Vol 209 ◽  
pp. 20-27 ◽  
Author(s):  
Reda Abdelbaset ◽  
Marwan Abouelalla ◽  
Yehya H. Ghallab ◽  
Hamdy Abdelhamid ◽  
Yehea Ismail

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