2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410829 ◽

2021 ◽

Author(s):

Jonas Gleichauf ◽

Youssef Maniar ◽

Steffen Wiese

Keyword(s):

Solder Joints ◽

Automotive Applications ◽

Bending Load

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Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410856 ◽

2021 ◽

Author(s):

Alessandro Sitta ◽

Giuseppe Mauromicale ◽

Vittorio Giuffrida ◽

Alessandra Manzitto ◽

Marco Papaserio ◽

...

Keyword(s):

Silicon Carbide ◽

Parametric Study ◽

Power Module

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Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410869 ◽

2021 ◽

Author(s):

E Liu ◽

Fosca Conti ◽

Sri Krishna Bhogaraju ◽

Gordon Elger

Keyword(s):

Silicon Nitride

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Numerical and Experimental Study on Determination Method of Elastoplastic Properties for Indentation Testing

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410866 ◽

2021 ◽

Author(s):

Kento Kariya ◽

Noriyuki Masago

Keyword(s):

Experimental Study ◽

Determination Method ◽

Indentation Testing ◽

Elastoplastic Properties

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Reliability of LED-based Systems

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410861 ◽

2021 ◽

Author(s):

Willem D. van Driel ◽

B. Jacobs ◽

P. Watte ◽

X. Zhao

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Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410882 ◽

2021 ◽

Author(s):

Philipp Adler ◽

Regine Mallwitz

Keyword(s):

Reliability Analysis ◽

Automotive Applications ◽

Electrolytic Capacitors

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Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410828 ◽

2021 ◽

Author(s):

Abhishek Deshpande ◽

Qian Jiang ◽

Abhijit Dasgupta

Keyword(s):

Solder Joints ◽

Shear Loading ◽

Sac305 Solder ◽

Cyclic Shear ◽

Model Based ◽

Scale Modeling ◽

Mechanical Cycling

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Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410862 ◽

2021 ◽

Author(s):

Mario Gschwandl ◽

Martin Pfost ◽

Thomas Antretter ◽

Peter Filipp Fuchs ◽

Ivaylo Mitev ◽

...

Keyword(s):

Power Electronics ◽

Reliability Assessment ◽

Mechanical Reliability ◽

Arbitrary Power

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IC package related stress effects on the characteristics of ring oscillator circuits

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410858 ◽

2021 ◽

Author(s):

S. Schlipf ◽

C. Sander ◽

A. Clausner ◽

J. Paul ◽

S. Capecchi ◽

...

Keyword(s):

Ring Oscillator ◽

Stress Effects ◽

Related Stress ◽

Ic Package ◽

Oscillator Circuits

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Characterization of the mechanical behavior of a Printed Circuit Board (PCB)

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410852 ◽

2021 ◽

Author(s):

A. Atintoh ◽

W. Kpobie ◽

N. Bonfoh ◽

M. Fendler ◽

P. Lipinski

Keyword(s):

Mechanical Behavior ◽

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit

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2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications

Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study

Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates

Numerical and Experimental Study on Determination Method of Elastoplastic Properties for Indentation Testing

Reliability of LED-based Systems

Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation

Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading

Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

IC package related stress effects on the characteristics of ring oscillator circuits

Characterization of the mechanical behavior of a Printed Circuit Board (PCB)

Export Citation Format

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications

Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study

Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates

Numerical and Experimental Study on Determination Method of Elastoplastic Properties for Indentation Testing

Reliability of LED-based Systems

Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation

Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading

Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

IC package related stress effects on the characteristics of ring oscillator circuits

Characterization of the mechanical behavior of a Printed Circuit Board (PCB)

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications