Low cycle fatigue models for lead-free solders

This paper investigates the fatigue results in low cycle fatigue region obtained from a miniaturized specimen having a 6mm gage length, 3mm diameter and 55mm total length. Fatigue tests were performed for two type lead-free solders using horizontal-type electrical servo hydraulic push-pull fatigue testing machine. Materials employed were Sn-3.0Ag-0.5Cu and Sn-5Sb. The results from Sn-3.0Ag-0.5Cu were compared with those obtained using a bulk specimen in a previous study. Relationship between strain range and number of cycles to failure of the small-sized specimen agreed with those of the bulk specimens. The testing techniques are applicable to Sn-5Sb following the Manson-Coffin law. These results confirm that the testing technique proposed here, using small-sized specimen, is suitable to get fruitful fatigue data for lead-free solder compounds.

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Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Journal of Electronic Materials ◽

10.1007/s11664-002-0100-0 ◽

2002 ◽

Vol 31 (5) ◽

pp. 456-465 ◽

Cited By ~ 91

Author(s):

Chaosuan Kanchanomai ◽

Yukio Miyashita ◽

Yoshiharu Mutoh

Keyword(s):

Low Cycle Fatigue ◽

Fatigue Behavior ◽

Lead Free ◽

Cycle Fatigue ◽

Lead Free Solders

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An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

Advances in Electronic Packaging, Parts A, B, and C ◽

10.1115/ipack2005-73152 ◽

2005 ◽

Author(s):

Takehiko Takahashi ◽

Susumu Hioki ◽

Ikuo Shohji ◽

Osamu Kamiya

Keyword(s):

Image Processing ◽

Fatigue Life ◽

Fatigue Test ◽

Surface Deformation ◽

Low Cycle Fatigue ◽

Fatigue Behavior ◽

Lead Free ◽

Cycle Fatigue ◽

Surface Features ◽

Lead Free Solders

The low-cycle fatigue behavior of Sn-3.5mass%Ag, Sn-0.7mass%Cu lead-free solders and Sn-37mass%Pb solder were investigated at strain rate of 0.1%/s with a non-contact extensometer at room temperature (22 ± 3 °C). In addition, the relationship between the surface features in the low-cycle fatigue test and the fatigue life of those solders were investigated by image processing. The fatigue lives of Sn-3.5mass%Ag and Sn-0.7mass%Cu were better than that of Sn-37mass%Pb. The low-cycle fatigue behavior on each solder followed Coffin-Manson equation. The surface deformation in fine wrinkles was observed in the low-cycle fatigue test at each solder. The surface features for each solder were evaluated by image processing from the surface deformation. The surface features in the low-cycle fatigue test did not appear until under 10% of the fatigue life for Sn-3.5mass%Ag, until 10% of the fatigue life for Sn-0.7mass%Cu, and until 20% of the fatigue life for Sn-37mass%Pb.

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P26 Low cycle fatigue reliability evaluation of lead-free solders

Proceedings of the 1992 Annual Meeting of JSME/MMD ◽

10.1299/jsmezairiki.2005.0_475 ◽

2005 ◽

Vol 2005 (0) ◽

pp. 475-476

Author(s):

Akifumi TANAKA ◽

Qiang YU ◽

Tadahiro SHIBUTANI ◽

Yusuke KOBAYASHI ◽

Masaki SHIRATORI

Keyword(s):

Low Cycle Fatigue ◽

Reliability Evaluation ◽

Lead Free ◽

Cycle Fatigue ◽

Fatigue Reliability ◽

Lead Free Solders

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An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.326-328.1035 ◽

2006 ◽

Vol 326-328 ◽

pp. 1035-1038 ◽

Cited By ~ 1

Author(s):

Takehiko Takahashi ◽

Susumu Hioki ◽

Ikuo Shohji ◽

Osamu Kamiya

Keyword(s):

Fatigue Life ◽

Surface Deformation ◽

Fatigue Testing ◽

Low Cycle Fatigue ◽

Fatigue Behavior ◽

Fatigue Property ◽

Lead Free ◽

Cycle Fatigue ◽

Lead Free Solders ◽

The Relationship

The low-cycle fatigue behavior and the relationship between the surface features in the low-cycle fatigue testing and the fatigue life of Sn-3.5Ag and Sn-0.7Cu lead-free solders were investigated at strain rate of 0.1%/s at room temperature, 80 and 120oC. In addition, the fatigue life was estimated by using the surface deformation of the solders, and image processing. And also, it was compared with Coffin-Manson type of fatigue behavior. The fatigue life of Sn-3.5Ag solder was superior to that of Sn-0.7Cu solder at temperatures, 80 and 120oC. The fatigue life determined by surface deformation indicated a close behavior to Coffin-Manson type fatigue behavior in those solders. Therefore the low-cycle fatigue life of solders could be estimated by the surface deformation.

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