High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90 nm RF-CMOS 5 GHz VCO

2005 European Microwave Conference ◽

10.1109/eumc.2005.1608797 ◽

2005 ◽

Cited By ~ 5

Author(s):

X. Sun ◽

D. Linten ◽

O. Dupuis ◽

G. Carchon ◽

P. Soussan ◽

...

Keyword(s):

Thin Film ◽

Rf Cmos ◽

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

On Chip ◽

5 Ghz

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High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2006.884827 ◽

2006 ◽

Vol 29 (4) ◽

pp. 810-817 ◽

Cited By ~ 23

Author(s):

Xiao Sun ◽

Olivier Dupuis ◽

Dimitri Linten ◽

Geert Carchon ◽

Philippe Soussan ◽

...

Keyword(s):

Thin Film ◽

Rf Cmos ◽

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

5 Ghz ◽

24 Ghz

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Suspended high Q integrated inductor by wafer level packaging technology

Microsystem Technologies ◽

10.1007/s00542-013-2010-x ◽

2013 ◽

Vol 21 (1) ◽

pp. 215-219 ◽

Cited By ~ 2

Author(s):

M. Han ◽

S. F. Wang ◽

G. W. Xu ◽

Le Luo

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Integrated Inductor ◽

Wafer Level Packaging

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A wafer-level poly-sige-based thin film packaging technology demonstrated on a soi-based high-Q MEM resonator

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference ◽

10.1109/transducers.2011.5969486 ◽

2011 ◽

Cited By ~ 1

Author(s):

Ph. Helin ◽

A. Verbist ◽

J. De Coster ◽

B. Guo ◽

S. Severi ◽

...

Keyword(s):

Thin Film ◽

Wafer Level ◽

Packaging Technology ◽

High Q

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High-Q inductors and transmission lines on 20 Ω.cm Si using wafer-level packaging technology

2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers. ◽

10.1109/smic.2003.1196682 ◽

2003 ◽

Author(s):

G. Carchon ◽

Xiao Sun ◽

W. De Raedt

Keyword(s):

Transmission Lines ◽

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging

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RF characterization of mold compound materials and high-$Q$ integrated passives using fan-out wafer-level packaging technology

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026638 ◽

2019 ◽

Cited By ~ 1

Author(s):

Xiao Sun ◽

John Slabbekoorn ◽

Dimitrios Velenis ◽

Andy Miller ◽

Geert Van der Plas ◽

...

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

Integrated Passives ◽

Compound Materials

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Wafer-Level Packaging Technology for High-<tex>$Q$</tex>On-Chip Inductors and Transmission Lines

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2004.825656 ◽

2004 ◽

Vol 52 (4) ◽

pp. 1244-1251 ◽

Cited By ~ 73

Author(s):

G.J. Carchon ◽

W. DeRaedt ◽

E. Beyne

Keyword(s):

Transmission Lines ◽

Wafer Level ◽

Packaging Technology ◽

Wafer Level Packaging ◽

On Chip

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Analysis of high-Q on-chip inductors realized by wafer-level packaging techniques

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216496 ◽

2004 ◽

Cited By ~ 6

Author(s):

X. Sun ◽

G. Carchon ◽

W. De Raedt ◽

E. Beyne

Keyword(s):

Wafer Level ◽

High Q ◽

Wafer Level Packaging ◽

On Chip

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Design and fabrication of suspended high Q MIM capacitors by wafer level packaging technology

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236551 ◽

2015 ◽

Cited By ~ 2

Author(s):

Tao Zheng ◽

Mei Han ◽

Gaowei Xu ◽

Le Luo ◽

Tao Zheng

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

Mim Capacitors

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MEMS Wafer-level Packaging Technology Using LTCC Wafer

IEEJ Transactions on Sensors and Micromachines ◽

10.1541/ieejsmas.132.246 ◽

2012 ◽

Vol 132 (8) ◽

pp. 246-253 ◽

Cited By ~ 1

Author(s):

Mamoru Mohri ◽

Masayoshi Esashi ◽

Shuji Tanaka

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

Wafer Level Packaging

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High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

2020 50th European Microwave Conference (EuMC) ◽

10.23919/eumc48046.2021.9337984 ◽

2021 ◽

Author(s):

Kavin Senthil Murugesan ◽

Mykola Chernobryvko ◽

Sherko Zinal ◽

Marco Rossi ◽

Ivan Ndip ◽

...

Keyword(s):

Wafer Level ◽

High Quality ◽

Packaging Technology ◽

Integrated Inductor ◽

Wafer Level Packaging

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