High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90 nm RF-CMOS 5 GHz VCO

2005 ◽  
Author(s):  
X. Sun ◽  
D. Linten ◽  
O. Dupuis ◽  
G. Carchon ◽  
P. Soussan ◽  
...  
Keyword(s):  
Thin Film ◽  
Rf Cmos ◽  
Wafer Level ◽  
Packaging Technology ◽  
High Q ◽  
Wafer Level Packaging ◽  
On Chip ◽  
5 Ghz

High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA

2006 ◽  
Vol 29 (4) ◽  
pp. 810-817 ◽  
Author(s):  
Xiao Sun ◽  
Olivier Dupuis ◽  
Dimitri Linten ◽  
Geert Carchon ◽  
Philippe Soussan ◽  
...  
Keyword(s):  
Thin Film ◽  
Rf Cmos ◽  
Wafer Level ◽  
Packaging Technology ◽  
High Q ◽  
Wafer Level Packaging ◽  
5 Ghz ◽  
24 Ghz

Suspended high Q integrated inductor by wafer level packaging technology

2013 ◽  
Vol 21 (1) ◽  
pp. 215-219 ◽  
Author(s):  
M. Han ◽  
S. F. Wang ◽  
G. W. Xu ◽  
Le Luo
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
High Q ◽  
Integrated Inductor ◽  
Wafer Level Packaging

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

2021 ◽  
Author(s):  
Kavin Senthil Murugesan ◽  
Mykola Chernobryvko ◽  
Sherko Zinal ◽  
Marco Rossi ◽  
Ivan Ndip ◽  
...  
Keyword(s):  
Wafer Level ◽  
High Quality ◽  
Packaging Technology ◽  
Integrated Inductor ◽  
Wafer Level Packaging
Sign in / Sign up

Export Citation Format

Share Document