A parallel-plate MEMS variable capacitor with vertical thin-film comb actuators

2007 ◽  
Author(s):  
Maher Bakri-Kassem ◽  
Raafat R. Mansour
Keyword(s):  
Thin Film ◽  
Parallel Plate ◽  
Variable Capacitor

scholarly journals Design Optimization of MEMS Based LLC Tunable Resonant Converter for Power Supplies on Chip

2013 ◽  
Vol 705 ◽  
pp. 258-263
Author(s):  
Fahimullah Khan ◽  
Yong Zhu ◽  
Jun Wei Lu ◽  
Dzung Dao
Keyword(s):  
Resonant Frequency ◽  
Resonance Frequency ◽  
Parallel Plate ◽  
Power Supplies ◽  
Resonant Converter ◽  
Load Variations ◽  
Leakage Inductance ◽  
Variable Capacitor ◽  
Numerical Software ◽  
On Chip

In this paper, a novel MEMS based LLC converter is proposed for on chip power supplies. The design is optimized based on commercially available Metal MUMPs process for fabrication. The resonant frequency is optimized at 20MHz and MEMS based variable capacitor is fabricated on the chip to tune the peak resonance frequency of circuit which varies due to the load variations. The Design is simulated in FEM based numerical software COMSOL and Intellisuite. According to analysis the magnetizing inductance of 42nH and leakage inductance of 40nH has been achieved from 16 mm2 rectangular coil transformer. The total capacitance of 1500pF has been achieved from parallel plate capacitors and variation of 3pF has been achieved from variable capacitor.

Removal of antibiotics in a parallel-plate thin-film-photocatalytic reactor: Process modeling and evolution of transformation by-products and toxicity

2017 ◽  
Vol 60 ◽  
pp. 114-122 ◽  
Author(s):  
Can Burak Özkal ◽  
Zacharias Frontistis ◽  
Maria Antonopoulou ◽  
Ioannis Konstantinou ◽  
Dionissios Mantzavinos ◽  
...  
Keyword(s):  
Thin Film ◽  
Process Modeling ◽  
Parallel Plate ◽  
Photocatalytic Reactor ◽  
By Products

A Comparative Study of Thin-Film and Reynolds Equation Simulation Models for Squeeze Film Damping in MEMS Plate Structures

2011 ◽  
Vol 403-408 ◽  
pp. 4580-4587
Author(s):  
Wei Guo Liu ◽  
Wei Wang ◽  
Shou Jun Peng
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Knudsen Number ◽  
Parallel Plate ◽  
Reynolds Equation ◽  
Perforated Plate ◽  
Squeeze Film ◽  
Squeeze Film Damping ◽  
Knudsen Numbers ◽  
Viscosity Modification

Squeeze film damping effect of MEMS parallel plate structure was analyzed based on thin film and Reynolds Equation in ANSYS under the different Knudsen numbers. Perforation effect of parallel plate with certain size and operating frequency was achieved under the different Knudsen numbers, the simulation results of two methods are very close. For unperforated plate, when Knudsen number is below 0.01, the discrepancy of two simulations is nonsignificant, and it grows up with Knudsen number. But gas rarefaction effects related with Knudsen number was considered in heat transfer analogy theory and used viscosity modification according to Veijola model, two simulations get the same result. For perforated plate, the simulation discrepancy of two methods will be great because of channel flow's effect and also grow up with Knudsen number, it can't be avoided even if the channel flow's effect and viscosity modification were concerned in heat transfer analogy theory.

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