A high-speed front-end circuit for high-resolution pipelined ADC's with a merged sample-and-hold amplifier

Author(s):  
Ting Li ◽  
Yan Wang ◽  
Yong Zhang ◽  
Lu Liu ◽  
Xu Wang
2013 ◽  
Vol 78 (2) ◽  
pp. 409-419 ◽  
Author(s):  
Alireza Abolhasani ◽  
Mohammad Tohidi ◽  
Khayrollah Hadidi ◽  
Abdollah Khoei

2014 ◽  
Vol 608-609 ◽  
pp. 670-673
Author(s):  
Qi Zhu

Using high-resolution CCD chip and high-speed A/D converter chip, the design of the Video Communication System is given in this article, which successfully realizes the drive of the high-resolution area CCD and achieves the digital image signal. Based on the thought of SoPC’s (System on Programmable Chip) high integration, on the ALTERA company's DE2 platform, FPGA is used to achieve the driving timing of CCD, Silicon delay lines are used to properly align the pixel rate CCD clock signals with respect to one another, and the push-pull transistor circuits are designed to translate TTL level driving clock signal to the voltage levels required by the CCD. The system demonstrates some application values by analysis.


Author(s):  
Kenneth Krieg ◽  
Richard Qi ◽  
Douglas Thomson ◽  
Greg Bridges

Abstract A contact probing system for surface imaging and real-time signal measurement of deep sub-micron integrated circuits is discussed. The probe fits on a standard probe-station and utilizes a conductive atomic force microscope tip to rapidly measure the surface topography and acquire real-time highfrequency signals from features as small as 0.18 micron. The micromachined probe structure minimizes parasitic coupling and the probe achieves a bandwidth greater than 3 GHz, with a capacitive loading of less than 120 fF. High-resolution images of submicron structures and waveforms acquired from high-speed devices are presented.


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