Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits
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Abstract A contact probing system for surface imaging and real-time signal measurement of deep sub-micron integrated circuits is discussed. The probe fits on a standard probe-station and utilizes a conductive atomic force microscope tip to rapidly measure the surface topography and acquire real-time highfrequency signals from features as small as 0.18 micron. The micromachined probe structure minimizes parasitic coupling and the probe achieves a bandwidth greater than 3 GHz, with a capacitive loading of less than 120 fF. High-resolution images of submicron structures and waveforms acquired from high-speed devices are presented.
2001 ◽
Vol 427
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pp. 73-105
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2014 ◽
Vol 13
(4)
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pp. 685-702
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2005 ◽
Vol 38
(2)
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pp. 260-265
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2009 ◽
Vol 80
(10)
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pp. 103701
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