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Study of Package Reliability according to the Epoxy Molding Compound
Mapping Intimacies
◽
10.1109/icept52650.2021.9568023
◽
2021
◽
Author(s):
Eunsol Jo
◽
Jung-Rae Park
◽
Cheong-Ha Jung
◽
Gu-Sung Kim
Keyword(s):
Epoxy Molding Compound
◽
Molding Compound
◽
Package Reliability
Download Full-text
Related Documents
Cited By
References
In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging
Journal of Thermal Analysis and Calorimetry
◽
10.1007/s10973-021-10941-w
◽
2021
◽
Author(s):
Yi He
◽
Mohammad Kabiri
Keyword(s):
Electronic Packaging
◽
Moisture Absorption
◽
In Situ Characterization
◽
Epoxy Molding Compound
◽
Molding Compound
◽
Hygroscopic Swelling
Download Full-text
Warpage Control Method in Epoxy Molding Compound
2020 China Semiconductor Technology International Conference (CSTIC)
◽
10.1109/cstic49141.2020.9282577
◽
2020
◽
Author(s):
Wei Tan
◽
Cheng Cheng
◽
Hongjie Liu
◽
Yangyang Duan
◽
Linlin Liu
◽
...
Keyword(s):
Control Method
◽
Epoxy Molding Compound
◽
Molding Compound
Download Full-text
Epoxy Molding Compound Development for Improved MSL1 Delamination Resistance in Plastic Encapsulated Clip Bond Power Package
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
◽
10.1109/eptc50525.2020.9315114
◽
2020
◽
Author(s):
April Joy Garete
◽
Zhiwen Li
◽
Arnel Taduran
Keyword(s):
Epoxy Molding Compound
◽
Molding Compound
◽
Delamination Resistance
Download Full-text
Sulfur-containing compound in epoxy molding compound
2014 15th International Conference on Electronic Packaging Technology
◽
10.1109/icept.2014.6922685
◽
2014
◽
Cited By ~ 1
Author(s):
Xingming Cheng
◽
Hongjie Liu
◽
Wei Tan
◽
Chi Qiu
◽
Lanxia Li
◽
...
Keyword(s):
Epoxy Molding Compound
◽
Molding Compound
◽
Sulfur Containing
Download Full-text
Tribological behavior of TiN and CrN coatings sliding against an epoxy molding compound
Surface and Coatings Technology
◽
10.1016/s0257-8972(00)00709-x
◽
2000
◽
Vol 130
(2-3)
◽
pp. 240-247
◽
Cited By ~ 43
Author(s):
W.H. Zhang
◽
J.H. Hsieh
Keyword(s):
Tribological Behavior
◽
Epoxy Molding Compound
◽
Molding Compound
◽
Crn Coatings
Download Full-text
Characterization of the rheological properties of a fast-curing epoxy-molding compound
Journal of Rheology
◽
10.1122/1.550809
◽
1997
◽
Vol 41
(2)
◽
pp. 177-195
◽
Cited By ~ 15
Author(s):
Sejin Han
◽
K. K. Wang
◽
C. A. Hieber
◽
C. Cohen
Keyword(s):
Rheological Properties
◽
Epoxy Molding Compound
◽
Molding Compound
Download Full-text
The evaluation of flowability and wire sweep by epoxy molding compound for power module packages using Moldflow™
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
◽
10.1109/eurosime.2013.6529940
◽
2013
◽
Cited By ~ 1
Author(s):
Taekkeun Lee
◽
Aimee Lim
◽
Youngsun Ko
◽
Taewoo Lee
◽
Byoungok Lee
Keyword(s):
Power Module
◽
Epoxy Molding Compound
◽
Molding Compound
Download Full-text
Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames
ACS Omega
◽
10.1021/acsomega.1c05914
◽
2021
◽
Author(s):
Naoaki Tsurumi
◽
Yuta Tsuji
◽
Noriyuki Masago
◽
Kazunari Yoshizawa
Keyword(s):
Adhesive Interaction
◽
Epoxy Molding Compound
◽
Molding Compound
Download Full-text
Wafer Form Warpage Characterization Based on Composite Factors Including Passivation Films, Re-Distribution Layers, Epoxy Molding Compound Utilized in Innovative Fan-Out Package
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2017.20
◽
2017
◽
Cited By ~ 6
Author(s):
Cheng-Hsiang Liu
◽
Lu-Yi Chen
◽
Chang-Lun Lu
◽
Hung-Chi Chen
◽
Cheng-Yi Chen
◽
...
Keyword(s):
Epoxy Molding Compound
◽
Molding Compound
Download Full-text
Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement
2021 International Conference on Electronics Packaging (ICEP)
◽
10.23919/icep51988.2021.9451923
◽
2021
◽
Author(s):
Joyce Chen
◽
Vance Liu
◽
Lewis Lin
◽
Min Chung
◽
Chong Leong Gan
◽
...
Keyword(s):
Epoxy Molding Compound
◽
Molding Compound
Download Full-text
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