Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

ACS Omega ◽

10.1021/acsomega.1c05914 ◽

2021 ◽

Author(s):

Naoaki Tsurumi ◽

Yuta Tsuji ◽

Noriyuki Masago ◽

Kazunari Yoshizawa

Keyword(s):

Adhesive Interaction ◽

Epoxy Molding Compound ◽

Molding Compound

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In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging

Journal of Thermal Analysis and Calorimetry ◽

10.1007/s10973-021-10941-w ◽

2021 ◽

Author(s):

Yi He ◽

Mohammad Kabiri

Keyword(s):

Electronic Packaging ◽

Moisture Absorption ◽

In Situ Characterization ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Hygroscopic Swelling

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Warpage Control Method in Epoxy Molding Compound

2020 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic49141.2020.9282577 ◽

2020 ◽

Author(s):

Wei Tan ◽

Cheng Cheng ◽

Hongjie Liu ◽

Yangyang Duan ◽

Linlin Liu ◽

...

Keyword(s):

Control Method ◽

Epoxy Molding Compound ◽

Molding Compound

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Epoxy Molding Compound Development for Improved MSL1 Delamination Resistance in Plastic Encapsulated Clip Bond Power Package

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315114 ◽

2020 ◽

Author(s):

April Joy Garete ◽

Zhiwen Li ◽

Arnel Taduran

Keyword(s):

Epoxy Molding Compound ◽

Molding Compound ◽

Delamination Resistance

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Sulfur-containing compound in epoxy molding compound

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922685 ◽

2014 ◽

Author(s):

Xingming Cheng ◽

Hongjie Liu ◽

Wei Tan ◽

Chi Qiu ◽

Lanxia Li ◽

...

Keyword(s):

Epoxy Molding Compound ◽

Molding Compound ◽

Sulfur Containing

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Tribological behavior of TiN and CrN coatings sliding against an epoxy molding compound

Surface and Coatings Technology ◽

10.1016/s0257-8972(00)00709-x ◽

2000 ◽

Vol 130 (2-3) ◽

pp. 240-247 ◽

Author(s):

W.H. Zhang ◽

J.H. Hsieh

Keyword(s):

Tribological Behavior ◽

Epoxy Molding Compound ◽

Molding Compound ◽

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Characterization of the rheological properties of a fast-curing epoxy-molding compound

Journal of Rheology ◽

10.1122/1.550809 ◽

1997 ◽

Vol 41 (2) ◽

pp. 177-195 ◽

Author(s):

Sejin Han ◽

K. K. Wang ◽

C. A. Hieber ◽

C. Cohen

Keyword(s):

Rheological Properties ◽

Epoxy Molding Compound ◽

Molding Compound

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The evaluation of flowability and wire sweep by epoxy molding compound for power module packages using Moldflow™

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529940 ◽

2013 ◽

Author(s):

Taekkeun Lee ◽

Aimee Lim ◽

Youngsun Ko ◽

Taewoo Lee ◽

Byoungok Lee

Keyword(s):

Power Module ◽

Epoxy Molding Compound ◽

Molding Compound

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Wafer Form Warpage Characterization Based on Composite Factors Including Passivation Films, Re-Distribution Layers, Epoxy Molding Compound Utilized in Innovative Fan-Out Package

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.20 ◽

2017 ◽

Author(s):

Cheng-Hsiang Liu ◽

Lu-Yi Chen ◽

Chang-Lun Lu ◽

Hung-Chi Chen ◽

Cheng-Yi Chen ◽

...

Keyword(s):

Epoxy Molding Compound ◽

Molding Compound

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Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement

2021 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep51988.2021.9451923 ◽

2021 ◽

Author(s):

Joyce Chen ◽

Vance Liu ◽

Lewis Lin ◽

Min Chung ◽

Chong Leong Gan ◽

...

Keyword(s):

Epoxy Molding Compound ◽

Molding Compound

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Novel method to reduce the delamination between epoxy molding compound and lead frame silver surface

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201907 ◽

2020 ◽

Author(s):

Chao He ◽

Colin Feng ◽

Tina Li

Keyword(s):

Silver Surface ◽

Epoxy Molding Compound ◽

Molding Compound ◽

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