Experimental investigation and numerical simulation of one novel incremental bending process

2017 ◽  
Author(s):  
Jianbin Ruan ◽  
Feifei Zhang ◽  
Kai He ◽  
Xiaobing Dang ◽  
Ruxu Du
Keyword(s):  
Numerical Simulation ◽  
Experimental Investigation ◽  
Bending Process

Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process

1991 ◽  
Vol 226 ◽  
Author(s):  
Wang Chunqing ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Thermal Conductivity ◽  
Numerical Simulation ◽  
Experimental Investigation ◽  
Thermal Process ◽  
Light Wave ◽  
Light Reflection ◽  
Lead Wire ◽  
Wire Surface ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

AbstractIn this paper,a numerical simulation of thermal process in the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials all have been considered. In order to carry this numerical calculation practice and prove it's results,the reflexive characteristic of light wave to the SMT materials has been gauged,and the dynamic temperature process of laser microjoint has been measured by a new experimental method which was invented by the authors.The results of numerical simulation have been borne out by the tests, and the influences of heating parameters on thermal process has been analysed in this paper.The conclusions will be advantageous to the further study of the microjoint quality control in the SMT laser microsoldering.

Numerical Simulation of Plate Bender Bending Process

2011 ◽  
Vol 189-193 ◽  
pp. 2228-2232
Author(s):  
Xue Jiang Liu ◽  
Hai Sheng Liu ◽  
Jing Liu ◽  
Hui Gang Wang
Keyword(s):  
Numerical Simulation ◽  
Stress Distribution ◽  
Mechanical Behavior ◽  
Process Optimization ◽  
Plate Bending ◽  
Bending Process

The plate’s mechanical behavior of three-roller plate bending machine had been analyzed in case of upper roller feeding based on ANSYS. Strain and stress distribution of the plate and its changes are gained. The influence of upper roller’s feeding location and bending velocity to bending process are researched. The results are valuable to bending process optimization and practical technique of plate bending.

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