Effect of base thickness reduction on high speed characteristics and base resistance of InGaAs/InP heterojunction bipolar transistor

Author(s):  
M. Kahn ◽  
S. Blayac ◽  
M. Riet ◽  
P. Berdaguer ◽  
V. Dhalluin ◽  
...  
Author(s):  
Fan Ren ◽  
Cammy R. Abernathy ◽  
J. M. Van Hove ◽  
P. P. Chow ◽  
R. Hickman ◽  
...  

A GaN/AlGaN heterojunction bipolar transistor has been fabricated using Cl2/Ar dry etching for mesa formation. As the hole concentration increases due to more efficient ionization of the Mg acceptors at elevated temperatures (> 250°C), the device shows improved gain. Future efforts should focus on methods for reducing base resistance, which are briefly summarized.


1996 ◽  
Vol 25 (10) ◽  
pp. 1637-1639
Author(s):  
M. T. Fresina ◽  
D. A. Ahmaki ◽  
S. Thomas ◽  
D. W. Barlage ◽  
C. A. Martino ◽  
...  

1998 ◽  
Vol 09 (02) ◽  
pp. 549-566
Author(s):  
JOHN SITCH ◽  
ROBERT SURRIDGE

Heterojunction bipolar transistor (HBT) integrated circuits are just beginning to appear on the commercial market, mostly as small-scale microwave and broadband parts. The high-speed portion of Nortel's OC-192 fiber communications product makes extensive use of this new technology, and this article describes the rationale for using HBT ICs in such a system, and the philosophy behind HBT IC introduction.


2013 ◽  
Vol 19 (2) ◽  
pp. 7900109-7900109 ◽  
Author(s):  
Pengfei Wu ◽  
R. E. Clarke ◽  
J. Novak ◽  
Shengling Deng ◽  
J. F. McDonald ◽  
...  

2000 ◽  
Author(s):  
Mark Rodwell ◽  
M. Urtega ◽  
D. Scott ◽  
M. Dahlstrom ◽  
Y. Betser

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