Aluminum Nitride-Silicon Carbide Alloy Crystals Grown on SiC Substrates by Sublimation

AlN-SiC alloy crystals, with a thickness greater than 500 µm, were grown on 4H- and 6H-SiC substrates from a mixture of AlN and SiC powders by the sublimation-recondensation method at 1860-1990 °C. On-axis SiC substrates produced a rough surface covered with hexagonal grains, while 6H- and 4H- off-axis SiC substrates with different miscut angles (8° or 3.68°) formed a relatively smooth surface with terraces and steps. The substrate misorientation ensured that the AlN-SiC alloy crystals grew two dimensionally as identified by scanning electron microscopy (SEM). X-ray diffraction (XRD) and transmission electron microscopy (TEM) confirmed that the AlN-SiC alloys had the wurtzite structure. Electron probe microanalysis (EPMA) and x-ray photoelectron spectroscopy (XPS) demonstrated that the resultant alloy crystals had non-stoichiometric ratios of Al:N and Si:C and a uniform composition throughout the alloy crystal from the interface to the surface. The composition ratio of Al:Si of the alloy crystals changed with the growth temperature, and differed from the original source composition, which was consistent with the results predicted by thermodynamic calculation of the solid-vapor distribution of each element. XPS detected the bonding between Si-C, Si-N, Si-O for the Si 2p spectra. The dislocation density decreased with the growth, which was lower than 106 cm−2 at the alloy surface, more than two orders of magnitude lower compared to regions close to the crystal/substrate interface, as determined by TEM.

Time-resolved Spectroscopy of the violet luminescence of undoped AlN

We report on the time-resolved luminescence of the defect-related violet band from undoped AlN epitaxial layers grown on sapphire and SiC. For both measurements in photoluminescence and in cathodoluminescence a decay of algebraic nature at long times is observed. This is typical for donor-acceptor pair transitions. We compare the behavior of this band to that of the generically yellow luminescence of GaN.

Core-Level Photoemission From Stoichiometric GaN(0001)-1×1

We report on a high-resolution x-ray photoelectron spectroscopy (HRXPS) study using synchrotron radiation, for the identification of the core level binding energies of Ga 3d and N 1s, from a stoichiometric Ga-polar GaN(0001)-1×1 sample.Three surface shifted components were found on the stoichiometric surface for the Ga 3d feature. The first surface shifted component has a higher binding energy of 0.85 eV, and is interpreted as surface Ga with one of the N bonds replaced by an empty dangling bond. This structure is belonging to the stoichiometric clean and ordered Ga-polar GaN(0001)-1×1 surface. The second, with a binding energy relative the bulk of −0.76 eV, is interpreted as Ga with one of the bonds to a Ga atom, which indicates a slight excess of Ga on the surface. The third surface shifted component is shifted by 2.01 eV and is related to gallium oxide in different configurations.The N 1s feature is complex with five surface shifted components relative the bulk were found. Two components with binding energy shifts of −0.54 eV and 0.47 eV are interpreted as surface shifted core levels from the stoichiometric, clean Ga-polar GaN(0001)-1×1 surface.We also analysed the Ga 3d spectrum after deposition of 1.5 ML of Ga on a stoichiometric surface. The surface shift for the Ga 3d5/2 component from the Ga overlayer is −1.74 eV relative the bulk GaN.The C 1s and O 1s core levels from remaining surface contamination have also been line shaped analysed and show complex structures.

Origin of ring defects in high In content green InGaN/GaN MQW: An Ultrasonic Force Microscopy Study

Observation of GaN-based islands surrounded by V-defects in the barrier layer of green LED is reported for InGaN MQWs deposited under no hydrogen or at growth temperatures of less than 800°C. Nanoscale mechanical properties of the areas enclosed and outside of the ring defects does not show any appreciable variation as measured by UFM. Chemical etching of the MQW structure in addition to cross-sectional TEM analysis ruled out the possibility of growth of inversion domains of N-polar GaN in a Ga-polar GaN matrix.

Development of High Power Green Light Emitting Diode Chips

The development of high emission power green light emitting diodes chips using GaInN/GaN multi quantum well heterostructures on sapphire substrate in our group is being reviewed. We analyze the electronic bandstructure in highly polarized GaInN/GaN quantum wells to identify the appropriate device structures. We describe the optimization of the epitaxial growth for highest device performance. Applying several optimization schemes, we find that lateral smoothness and homogeneity of the active region as characterized by atomic force microscopy is a most telling character of high yield, high output power devices emitting near 525 nm. In un-encapsulated epi-up mounted (400 μm)2 die we achieve 2.5 mW at 20 mA at 525 nm. We describe die performance, wafer yield, and process stability, and reproducibility for our production-scale implementation of this green LED die process.

Review of polarity determination and control of GaN

Polarity issues affecting III-V nitride semiconductors are reviewed with respect to their determination and control. A set of conditions crucial to the polarity control of GaN is provided for each of the following growth techniques; molecular beam epitaxy (MBE), pulsed laser deposition (PLD) and hydride vapor phase epitaxy (HVPE). Although GaN films might have been deposited by identical growth methods using the same buffer layer technologies, there is often a conflict between the resulting polarities achieved by different research groups. In this paper, we present the implications of the conditions used in each of the processes used for two-step metalorganic chemical vapor deposition (MOCVD), demonstrating systematic control of the polarity of GaN films on sapphire substrates. The potential for confusion in polarity control will be explained, taking into account the implications clarified in our studies. The correlation between the polarity and the growth conditions will be discussed in order to provide a mechanism for the determination and control of the crystal polarity during the growth of GaN films.

Growth of AlN crystals on AlN/SiC seeds by AlN powder sublimation in nitrogen atmosphere

AlN single crystals were grown on AlN/SiC seeds by sublimation of AlN powder in TaC crucibles in a nitrogen atmosphere. The seeds were produced by metallorganic chemical vapor deposition (MOCVD) of AlN on SiC crystals. The influence of growth temperature, growth time and source-to-seed distance on the crystallinity and the crystal growth rate were investigated. Crystals were grown in an RF heated sublimation reactor at growth temperatures ranging from 1800-2000°C, at a pressure of 600 Torr, nitrogen flow-rate of 100 sccm and source-to-seed distances of 10 and 35 mm. At 1870°C and a source-to-seed distance of 35 mm, isolated crystals were observed with few instances of coalescence. At 1930°C, a source-to-seed distance of 10 mm and longer growth times (~30 hrs), crystal coalescence was achieved. Above 1930°C, the decomposition of SiC was evidently affecting the growth morphology and resulted in growth of polycrystalline AlN. After an initial nucleation period, the observed growth rates (10-30 µm/hr) were in close agreement with predictions of a growth model that assumed gas-phase diffusion controlled growth. Optical and electron microscope observations revealed step-flow growth, while X-ray diffraction results showed the single crystal nature of the grown material. Single crystalline AlN was grown over surface areas of 200-300 mm2 and was transparent and essentially colorless.

Low dislocation density, high power InGaN laser diodes

We used single crystals of GaN, obtained from high-pressure synthesis, as substrates for Metalorganics Vapor Phase Epitaxy growth of violet and UV laser diodes. The use of high-quality bulk GaN leads to the decrease of the dislocation density to the low level of 105 cm−2, i.e. two orders of magnitude better than typical for the Epitaxial Lateral Overgrowth laser structures fabricated on sapphire. The low density and homogeneous distribution of defects in our structures enables the realization of broad stripe laser diodes. We demonstrate that our laser diodes, having 15 μm wide stripes, are able to emit 1.3-1.9 W per facet (50% reflectivity) in 30 ns long pulses. This result, which is among the best ever reported for nitride lasers, opens the path for the development of a new generation of high power laser diodes.

Selective Etching of GaN from AlGaN/GaN and AlN/GaN Structures

Thick GaN layers as well as AlGaN/GaN and AlN/GaN heterostructures grown by metalorganic vapor phase epitaxy have been photoelectrochemically (PEC) etched in various dilute electrolytes, and bandgap-selective etching has been demonstrated in heterostructures. This result is a significant step forward in the fabrication of group III-nitride devices and one-dimensional photonic bandgap (PBG) structures in the deep UV. Based on initial results from thick GaN layers, a method was developed to achieve self-stopping selective etching of thin GaN layers in AlGaN/GaN and AlN/GaN heterostructures. Selective PEC etching requires the use of a suitable light source with photon energies larger than the bandgap of GaN, but smaller than that of AlGaN or AlN, thus enabling selective hole generation in the GaN layers to be etched. Additionally, it is imperative to use an electrolyte that supports PEC etching of GaN without chemically etching AlGaN or AlN.

The Durability of Various Crucible Materials for Aluminum Nitride Crystal Growth by Sublimation

Producing high purity aluminum nitride crystals by the sublimation-recondensation technique is difficult due to the inherently reactive crystal growth environment, normally at temperature in excess of 2100 °C. The durability of the furnace fixture materials (crucibles, retorts, etc.) at such a high temperature remains a critical problem. In the present study, the suitability of several refractory materials for AlN crystal growth is investigated, including tantalum carbide, niobium carbide, tungsten, graphite, and hot-pressed boron nitride. The thermal and chemical properties and performance of these materials in inert gas, as well as under AlN crystal growth conditions are discussed. TaC and NbC are the most stable crucible materials with very low elemental vapor pressures in the crystal growth system. Compared with refractory material coated graphite crucibles, HPBN crucible is better for AlN self-seeded growth, as crystals tend to nucleate in thin colorless platelets with low dislocation density.