Automotive field failure analysis based on mileage — Feasibility & benefits

2012 ◽  
Author(s):  
Vineet R. Khare ◽  
Pulak Bandyopadhyay ◽  
Mary B Waldo
Keyword(s):  
Failure Analysis ◽  
Field Failure

Reliability Analysis and Improvement of ATCs of CNC Lathes

2010 ◽  
Vol 37-38 ◽  
pp. 939-943 ◽  
Author(s):  
Yi Qiang Wang ◽  
Xiao Jun Wang ◽  
Shun Ming Hua
Keyword(s):  
Failure Analysis ◽  
Block Diagram ◽  
Numerical Control ◽  
Coding System ◽  
Failure Data ◽  
Cnc Lathe ◽  
Automatic Tool Changer ◽  
Automatic Tool ◽  
Set Up ◽  
Field Failure

An automatic tool changer (ATC) is one of the most important subsystems of a computerized numerical control (CNC) lathe. The field failure analysis is very important to improve the reliability of the ATC. The structure and mechanism of an ATC is briefly introduced. Its brief reliability block diagram is set up. With this understanding, through the collection of the field failure data, a coding system to code failure data is devised and a failure analysis database of CNC lathes is accrued. The failure mode and cause are analyzed to indicate the weak subsystem of the ATC. Some suggestions on improving the reliability have been proposed.

Field failure analysis of medium voltage XLPE-insulated power cables

2002 ◽  
Author(s):  
J.C. Chan ◽  
E.T. Cometa ◽  
M.D. Hartley ◽  
L.J. Hiivala
Keyword(s):  
Failure Analysis ◽  
Power Cables ◽  
Medium Voltage ◽  
Field Failure

A Case Study of Failure Analysis and Root Cause Identification on ESD-Induced Breakdown

2016 ◽  
Author(s):  
Hongmin Liu ◽  
Zhe Li ◽  
Zheng Weng
Keyword(s):  
Failure Analysis ◽  
Short Circuit ◽  
Resistance Change ◽  
Root Cause ◽  
Parametric Testing ◽  
Root Cause Identification ◽  
Failure Location ◽  
Static Discharge ◽  
Field Failure

Abstract This paper describes the detailed process of failure analysis (FA) of a 16-bit transceiver. The FA included six steps: electronic parametric testing, visual inspection, optical beam induced resistance change to isolate failure location, SEM inspection of the breakdown, electro static discharge (ESD) root identification, and ESD test to prove the identification. FA showed that the short circuit was the result of a breakdown between the I/O resistor and the substrate, and the cause of the breakdown was most likely an ESD event. In a series of electrical over stress/ESD tests performed, the field failure signature was replicated with a MM ESD model, thereby identifying the root cause of the ESD failure.

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