A low redeposition rate high density plasma CVD process for high aspect ratio 175 nm technology and beyond
Keyword(s):
1998 ◽
Vol 145
(12)
◽
pp. 4305-4312
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Keyword(s):
1998 ◽
Vol 16
(4)
◽
pp. 2722-2724
◽
2010 ◽
Vol 87
(5-8)
◽
pp. 859-863
◽
Keyword(s):
1997 ◽