A low redeposition rate high density plasma CVD process for high aspect ratio 175 nm technology and beyond

Author(s):  
G.Y. Lee ◽  
T.H. Ivers ◽  
G.D. Papasouliotis ◽  
E.W. Kiewra ◽  
X.J. Ning ◽  
...  
1998 ◽  
Vol 145 (12) ◽  
pp. 4305-4312 ◽  
Author(s):  
Simon Karecki ◽  
Laura Pruette ◽  
Rafael Reif ◽  
Terry Sparks ◽  
Laurie Beu ◽  
...  

1993 ◽  
Author(s):  
Jeffrey Marks ◽  
K. Collins ◽  
C. L. Yang ◽  
David Groechel ◽  
Peter R. Keswick ◽  
...  

1997 ◽  
Author(s):  
Wei Lu ◽  
Jia Z. Zheng ◽  
John Sudijuno ◽  
Hoon L. Yap ◽  
Kok S. Fam ◽  
...  

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