Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool

Journal of The Electrochemical Society ◽

10.1149/1.1838955 ◽

1998 ◽

Vol 145 (12) ◽

pp. 4305-4312 ◽

Author(s):

Simon Karecki ◽

Laura Pruette ◽

Rafael Reif ◽

Terry Sparks ◽

Laurie Beu ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

High Density ◽

Plasma Etch ◽

Download Full-text

Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.581415 ◽

1998 ◽

Vol 16 (4) ◽

pp. 2722-2724 ◽

Author(s):

Simon Karecki ◽

Laura Pruette ◽

Rafael Reif ◽

Laurie Beu ◽

Terry Sparks ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

High Density ◽

Plasma Etch ◽

Download Full-text

Electron shading effects in high density plasma processing for very high aspect ratio structures

1998 3rd International Symposium on Plasma Process-Induced Damage (Cat. No.98EX100) ◽

10.1109/ppid.1998.725599 ◽

2002 ◽

Author(s):

W.W. Dostalik ◽

S. Krishnan ◽

T. Kinoshita ◽

S. Rangan

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Plasma Processing ◽

High Density ◽

Shading Effects ◽

Very High ◽

Download Full-text

A low redeposition rate high density plasma CVD process for high aspect ratio 175 nm technology and beyond

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787106 ◽

2003 ◽

Author(s):

G.Y. Lee ◽

T.H. Ivers ◽

G.D. Papasouliotis ◽

E.W. Kiewra ◽

X.J. Ning ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

High Density ◽

Download Full-text

Introduction of a new high-density plasma reactor concept for high-aspect-ratio oxide etching

10.1117/12.142917 ◽

1993 ◽

Author(s):

Jeffrey Marks ◽

K. Collins ◽

C. L. Yang ◽

David Groechel ◽

Peter R. Keswick ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Plasma Reactor ◽

High Density ◽

Oxide Etching ◽

Download Full-text

Transport mechanisms of ions and neutrals in low-pressure, high-density plasma etching of high aspect ratio contact holes

Thin Solid Films ◽

10.1016/s0040-6090(00)01151-2 ◽

2000 ◽

Vol 374 (2) ◽

pp. 190-207 ◽

Author(s):

K. Nishikawa ◽

H. Ootera ◽

S. Tomohisa ◽

T. Oomori

Keyword(s):

Aspect Ratio ◽

Plasma Etching ◽

High Aspect Ratio ◽

Low Pressure ◽

High Density ◽

Transport Mechanisms ◽

Download Full-text

Technique for transfer of high-density, high-aspect-ratio nanoscale patterns in UV nanoimprint lithography and measurement of the release force

Microelectronic Engineering ◽

10.1016/j.mee.2009.12.051 ◽

2010 ◽

Vol 87 (5-8) ◽

pp. 859-863 ◽

Author(s):

Jun Taniguchi ◽

Yasuhiro Kamiya ◽

Takeshi Ohsaki ◽

Nobuji Sakai

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Nanoimprint Lithography ◽

High Density ◽

Nanoscale Patterns ◽

Download Full-text

High density and high aspect ratio solid micro-nanoprojection arrays for targeted skin vaccine delivery and specific antibody extraction

RSC Advances ◽

10.1039/c2ra20153d ◽

2012 ◽

Vol 2 (8) ◽

pp. 3490 ◽

Author(s):

Derek Jenkins ◽

Simon Corrie ◽

Christopher Flaim ◽

Mark Kendall

Keyword(s):

Aspect Ratio ◽

Specific Antibody ◽

High Aspect Ratio ◽

Vaccine Delivery ◽

Download Full-text

Investigation on Growth of High Density, Highly Vertically Oriented 1D ZnO Nanostructures with High Aspect Ratio by Solely Electrochemical Steps

ECS Meeting Abstracts ◽

10.1149/ma2010-01/2/134 ◽

2010 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

High Density ◽

Zno Nanostructures

Download Full-text

Wafer-level wet etching of high-aspect-ratio through silicon vias (TSVs) with high uniformity and low cost for silicon interposers with high-density interconnect of 3D packaging

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159783 ◽

2015 ◽

Author(s):

Liyi Li ◽

Jiali Wu ◽

C. P. Wong

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Low Cost ◽

High Density ◽

Wet Etching ◽

Wafer Level ◽

Through Silicon Vias ◽

High Uniformity ◽

3D Packaging ◽

Download Full-text

A direct plasma etch approach to high aspect ratio polymer micromachining with applications in bioMEMS and CMOS-MEMS

Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266) ◽

10.1109/memsys.2002.984223 ◽

2003 ◽

Author(s):

J.D. Zahn ◽

K.J. Gabriel ◽

G.K. Fedder

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Plasma Etch ◽

Download Full-text