Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints

Author(s):  
Ming-Yen Tsai ◽  
Yen-Liang Lin ◽  
C. Rob
2008 ◽  
Vol 47 (7) ◽  
pp. 5330-5332 ◽  
Author(s):  
Satoshi Harui ◽  
Hidetoshi Tamiya ◽  
Takanobu Akagi ◽  
Hideto Miyake ◽  
Kazumasa Hiramatsu ◽  
...  

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