Signal Integrity and Power Integrity Challenges in Embedded Computing Boards

2018 ◽  
Author(s):  
Suja Susan George ◽  
S Sivanantham ◽  
Sanjay Pawar ◽  
R Vikram
Keyword(s):  
Signal Integrity ◽  
Power Integrity ◽  
Embedded Computing

Signal Integrity Analysis for RF System-in-Package

2011 ◽  
Author(s):  
Jeff Chen ◽  
Weiping Li ◽  
Feng Ling
Keyword(s):  
Design Methodology ◽  
Electromagnetic Compatibility ◽  
Signal Integrity ◽  
Power Integrity ◽  
Rf System ◽  
Noise Coupling ◽  
Design Time ◽  
Close Proximity ◽  
First Pass ◽  
Integrity Analysis

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

Integral Equation Technique for the Simulation of Signal Integrity and Power Integrity

Frequenz ◽  
2011 ◽  
Vol 65 (9-10) ◽  
Author(s):  
Xing-Chang Wei ◽  
De-Cao Yang ◽  
Er-Ping Li
Keyword(s):  
Integral Equation ◽  
Signal Integrity ◽  
Power Integrity
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