Signal Integrity Analysis for RF System-in-Package

2011 ◽  
Author(s):  
Jeff Chen ◽  
Weiping Li ◽  
Feng Ling
Keyword(s):  
Design Methodology ◽  
Electromagnetic Compatibility ◽  
Signal Integrity ◽  
Power Integrity ◽  
Rf System ◽  
Noise Coupling ◽  
Design Time ◽  
Close Proximity ◽  
First Pass ◽  
Integrity Analysis

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

Signal and Power Integrity Co-Simulation on DDR Memory

2011 ◽  
Author(s):  
Md. Ruhul Quddus ◽  
Sanjiv Soman
Keyword(s):  
Traditional Method ◽  
Signal Integrity ◽  
Power Delivery ◽  
Signal Quality ◽  
Power Integrity ◽  
Random Data ◽  
Eye Diagram ◽  
Burst Data ◽  
Definition Of ◽  
Integrity Analysis

Even though it has always been known that Signal Integrity analysis and Power Integrity (Power Delivery) analysis are related, historically they have been treated and analyzed independently with some timing and voltage buckets used to tie the effects of one on the other. When the voltage and timing margins were large, this approach worked quite well. However as voltage levels, timing windows and their margins have shrunk, the traditional method of analyzing them independently no longer suffices. The signal quality and timing (eye height & eye width) losses due to the effects of power delivery are no longer negligible. The concept of signal integrity & power delivery co-simulation (referred to as SIPD or SIPI co-sim) is a methodology developed to address this problem. In this paper we will use the DDR bus as an example to illustrate the impacts of power delivery on the signal and highlight how badly the margin loss would have been underestimated if the effects of power delivery were ignored. The paper will demonstrate how SIPD co-sim can quantify or illustrate - the effects of data randomization, margin gain with fully random data patterns, margin loss due to the effects of Burst-Idle-Burst data patterns, definition of noise & eye diagram BER, statistically significant noise in system, etc.

Design Methodology of Laminating Tools

2014 ◽  
Vol 657 ◽  
pp. 121-125
Author(s):  
Daniel Măgurian ◽  
Gheorghe Oancea
Keyword(s):  
Software Package ◽  
Design Methodology ◽  
Software Tool ◽  
Design Time ◽  
Standard Design ◽  
Automotive Interior ◽  
Main Frame

This paper presents a design methodology of laminating tools for automotive interior parts using CATIA software package. The authors developed a software tool namedLTFrameDesignusingVBA for Applicationunder CATIA package, which automatically generates the main frame of the laminating tool according to the parts shapes, its dimensions and designer requirements. The software automates some stages of standard design and minimizes the design time and costs. The paper also presents the design stages which are followed by the user to obtain a 3D complete assembly of the laminating tool.

Statistical Signal Integrity Analysis and Diagnosis Methodology for High-Speed Systems

2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan
Keyword(s):  
High Speed ◽  
Signal Integrity ◽  
Integrity Analysis

Timing and Signal Integrity Analysis

2006 ◽  
pp. 63-1-63-34
Author(s):  
Abhijit Dharchoudhury ◽  
David Blaauw ◽  
Shantanu Ganguly
Keyword(s):  
Signal Integrity ◽  
Integrity Analysis
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