Erratum to “Continuous Color Reflective Display Fabricated in Integrated MEMS-and-TFTon- Glass Process” [Feb 17 143-157]

My subject is the float process for making flat glass. I would like, first of all, to put the float process into perspective by describing briefly, and in simple terms, the methods used for making flat glass before and at the time of the invention of the float process and then to describe the development of the process itself and the position it occupies in the flat glass industry today. Finally, I would like to describe in as much depth as time allows, three of the main problems which had to be tackled in developing this process. The Egyptians seem to have been the first people to realize what could be done with glass when it is hot and plastic, and they made vessels for cosmetics and perfumes by, it is assumed, trailing molten glass around a shaped core. By Roman times glass was being blown and moulded, cut and engraved, painted and gilded, and the Romans had mastered the plastic character of heat softened glass so fundamental to today’s processes.

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P-109: A High Contrast and Low Voltage PSCT Reflective Display

SID Symposium Digest of Technical Papers ◽

10.1889/1.1832357 ◽

2003 ◽

Vol 34 (1) ◽

pp. 641 ◽

Cited By ~ 3

Author(s):

Hongwen Ren ◽

Sebastian Gauza ◽

Shin-Tson Wu

Keyword(s):

Low Voltage ◽

High Contrast ◽

Reflective Display

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"on-glass" process option for BiCMOS technology

Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting ◽

10.1109/bipol.2004.1365747 ◽

2004 ◽

Cited By ~ 1

Author(s):

E. Aksen ◽

W.D. van Noort ◽

D. Bower ◽

N. Bell ◽

R. Dekker ◽

...

Keyword(s):

Bicmos Technology ◽

Glass Process

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Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress

Sensors ◽

10.3390/s19183979 ◽

2019 ◽

Vol 19 (18) ◽

pp. 3979

Author(s):

Jun Eon An ◽

Usung Park ◽

Dong Geon Jung ◽

Chihyun Park ◽

Seong Ho Kong

Keyword(s):

Thermal Stress ◽

Silicon Wafers ◽

Experimental Results ◽

Mems Devices ◽

Microelectromechanical System ◽

Die Attach ◽

Lack Of Control ◽

Die Bonding ◽

Glass Process ◽

Typical Process

Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of control over the spreading of the adhesive can cause non-uniform attachment. In this case, asymmetric packaging stress could be generated and transferred to the die. The performance of MEMS devices, which employ the differential outputs of the sensing elements, is directly affected by the asymmetric packaging stress. In this paper, we proposed a die-attach structure with a pillar to reduce the asymmetric packaging stress and the changes in packaging stress due to changes in the device temperature. To verify the proposed structure, we fabricated four types of differential resonant accelerometers (DRA) with the silicon-on-glass process. We confirmed experimentally that the pillar can control the spreading of the adhesive and that the asymmetric packaging stress is considerably reduced. The simulation and experimental results indicated that the DRAs manufactured using glass-on-silicon wafers as handle substrates instead of conventional glass wafers have a structure that compensates for the thermal stress.

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P-136: Electrical Color and Intensity Tuning in Cholesteric Reflective Display

SID Symposium Digest of Technical Papers ◽

10.1002/j.2168-0159.2014.tb00398.x ◽

2014 ◽

Vol 45 (1) ◽

pp. 1500-1503

Author(s):

Hossein Nemati ◽

Rafael S. Zola ◽

Deng-Ke Yang

Keyword(s):

Reflective Display

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Role of Unloading in Machining of Brittle Materials

Journal of Manufacturing Science and Engineering ◽

10.1115/1.1285903 ◽

1999 ◽

Vol 122 (3) ◽

pp. 452-462 ◽

Cited By ~ 16

Author(s):

A. Chandra ◽

K. Wang ◽

Y. Huang ◽

G. Subhash ◽

M. H. Miller ◽

...

Keyword(s):

Removal Rate ◽

Brittle Materials ◽

Pyrex Glass ◽

Finished Part ◽

Model Predictions ◽

Fracture Models ◽

Design Options ◽

Glass Process ◽

Simple Stress

A simple stress based defect evolution model is developed to assess the influence of various process parameters on material removal rate (MRR) and induced damage during grinding of brittle materials. Model predictions for normal and lateral damage zones under normal indentations are first compared to fracture models as well as experimental observations on pyrex glass. Process design options for reducing induced damage in the finished part, and increasing MRR are considered next. In particular, the potential of a new design avenue involving intermittent unloading is investigated. Simulation results show that intermittent unloading can potentially facilitate increase in Force/Grit without increasing the associated surface and sub-surface fragmentation in the finished part. Preliminary experimental observations on single grit scratching of pyrex glass also show a similar trend. [S1087-1357(00)01902-X]

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