DISABLED ANALYSIS OF CERAMIC PRODUCTS ON THE GLASS PROCESS USING THE SEVEN TOOLS METHOD (CASE STUDY: PT. NJMX SURABAYA

In the production process of quality is very off at PT. NJMX, a company engaged in the manufacture of ceramics where the quality of a good ceramic surface does not have any disability is expected by consumers. This study aims To identify the disability of ceramic products by using the seven tools method on the glaze process, applying the seven tools method as an effective tool to improve productivity and product quality in the process of making ceramic diunit glaze. From the data processing, it can be known that the type of defect that has a high percentage obtained is the pinhole with the total average defect is 57 units, other causes are Dimpel 53 units, 50 glaze cracking, 48 lines and 45 units waves. Of the five types of defects the highest percentage is pinhole defect with a total percentage of 22.60%, while for dimpel 20.90%, cracked glaze 19.66%, 18.93 and 18.93% waves. And obtained the average value of sigma 3.58 with DPMO value of 13.553%.

Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress

Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of control over the spreading of the adhesive can cause non-uniform attachment. In this case, asymmetric packaging stress could be generated and transferred to the die. The performance of MEMS devices, which employ the differential outputs of the sensing elements, is directly affected by the asymmetric packaging stress. In this paper, we proposed a die-attach structure with a pillar to reduce the asymmetric packaging stress and the changes in packaging stress due to changes in the device temperature. To verify the proposed structure, we fabricated four types of differential resonant accelerometers (DRA) with the silicon-on-glass process. We confirmed experimentally that the pillar can control the spreading of the adhesive and that the asymmetric packaging stress is considerably reduced. The simulation and experimental results indicated that the DRAs manufactured using glass-on-silicon wafers as handle substrates instead of conventional glass wafers have a structure that compensates for the thermal stress.