Near-Zero Power Integrated Microsystems for the IOT

Author(s):  
Sungho Kang ◽  
Vageeswar Rajaram ◽  
Sila Deniz Calisgan ◽  
Antea Risso ◽  
Zhenyun Qian ◽  
...  
Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 158
Author(s):  
Peng Huang ◽  
Dan-Liang Wen ◽  
Yu Qiu ◽  
Ming-Hong Yang ◽  
Cheng Tu ◽  
...  

In recent years, wearable electronic devices have made considerable progress thanks to the rapid development of the Internet of Things. However, even though some of them have preliminarily achieved miniaturization and wearability, the drawbacks of frequent charging and physical rigidity of conventional lithium batteries, which are currently the most commonly used power source of wearable electronic devices, have become technical bottlenecks that need to be broken through urgently. In order to address the above challenges, the technology based on triboelectric effect, i.e., triboelectric nanogenerator (TENG), is proposed to harvest energy from ambient environment and considered as one of the most promising methods to integrate with functional electronic devices to form wearable self-powered microsystems. Benefited from excellent flexibility, high output performance, no materials limitation, and a quantitative relationship between environmental stimulation inputs and corresponding electrical outputs, TENGs present great advantages in wearable energy harvesting, active sensing, and driving actuators. Furthermore, combined with the superiorities of TENGs and fabrics, textile-based TENGs (T-TENGs) possess remarkable breathability and better non-planar surface adaptability, which are more conducive to the integrated wearable electronic devices and attract considerable attention. Herein, for the purpose of advancing the development of wearable electronic devices, this article reviews the recent development in materials for the construction of T-TENGs and methods for the enhancement of electrical output performance. More importantly, this article mainly focuses on the recent representative work, in which T-TENGs-based active sensors, T-TENGs-based self-driven actuators, and T-TENGs-based self-powered microsystems are studied. In addition, this paper summarizes the critical challenges and future opportunities of T-TENG-based wearable integrated microsystems.


2005 ◽  
Author(s):  
Junseok Chae ◽  
Brian H. Stark ◽  
Andrew Kuo ◽  
Andrew David Oliver ◽  
Khalil Najafi

Electronics ◽  
2020 ◽  
Vol 9 (5) ◽  
pp. 766
Author(s):  
Hao Lv ◽  
Shengbing Zhang ◽  
Wei Han ◽  
Yongqiang Liu ◽  
Shuo Liu ◽  
...  

In recent years, microelectronics technology has entered the era of nanoelectronics/integrated microsystems. System in Package (SiP) and System on Chip (SoC) are two important technical approaches for microsystems. The development of micro-system technology has made it possible to miniaturize airborne and missile-borne electronic equipment. This paper introduces the design and implementation of an aerospace miniaturized computer system. The SiP chip uses Xilinx Zynq® SoC (2ARM® + FPGA), FLASH memory and DDR3 memory as the main components, and integrates with SiP high-density system packaging technology. The chip has the advantages of small size and ultra-low power consumption compared with the traditional PCB circuit design. A pure software-based DDR3 signal eye diagram test method is used to verify the improvement inf the signal integrity of the chip without the need for probe measurement. The method of increasing the thermal conductive silver glue was used to improve the thermal performance after the test and analysis. The SiP chip was tested and analyzed with other mainstream aviation computers using a heading measurement of extended Kalman filter (EKF) algorithm. The paper has certain reference value and research significance in the miniaturization of the aviation computer system, the heat dissipation technology of SiP chip and the test method of signal integrity.


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