Data rate penalty for high-density photonic integrated circuits in advanced modulation formats

2014 ◽  
Author(s):  
Toshimasa Umezawa ◽  
Tuptim Angkaew ◽  
Tetsuya Kawanishi
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Data Rate ◽  
High Density ◽  
Modulation Formats ◽  
Advanced Modulation Formats

HIGH DATA RATE SILICON PHOTONIC - CMOS ELECTRONIC MODULES USING COPPER MICROBUMPS

2015 ◽  
Vol 2015 (1) ◽  
pp. 000616-000620 ◽  
Author(s):  
S. Bernabé ◽  
G. Pares ◽  
B. Blampey ◽  
K. Rida ◽  
O. Castany ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Flip Chip ◽  
Photonic Integrated Circuits ◽  
Data Rate ◽  
Wire Bonding ◽  
High Density ◽  
High Data Rate ◽  
High Data ◽  
Silicon Photonic ◽  
Low Consumption

Achieving high data speed (typically Nx25 Gbps) compact optoelectronic modules is now made possible by using Photonic Integrated Circuits (PIC) combined with CMOS electronic drivers. Among the techniques that can be used to combine both circuits, flip-chip assembly based on micro-bumps shows several advantages, for example low RF parasitics and high density compared to wire bonding. Using this technique, it is possible to build low consumption photonic receivers working at 25 Gbps.

40-channel transmitter and receiver photonic integrated circuits operating at per channel data rate 12.5 Gbit/s

2007 ◽  
Vol 43 (8) ◽  
pp. 468 ◽  
Author(s):  
M. Kato ◽  
R. Nagarajan ◽  
J. Pleumeekers ◽  
P. Evans ◽  
A. Chen ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Data Rate
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