Extended reach gigabit passive optical networks for rural areas using Raman and semiconductor optical amplifiers

Author(s):  
K. L. Lee ◽  
J. L. Riding ◽  
A. V. Tran ◽  
R. S. Tucker
Doklady BGUIR ◽  
2021 ◽  
Vol 19 (4) ◽  
pp. 80-84
Author(s):  
A. D. Tussupov ◽  
A. T. Tokhmetov ◽  
N. I. Listopad

Gigabit passive optical networks (GPON) are the most advanced technology. The data transfer rate is 2.5 Gbps for downstream and 1.25 Gbps for upstreams. But this network architecture has a limited physical network length of 20 km. This is due to the high budgetary losses of the network. This restriction of access makes the network difficult to access for subscribers located far from the facilities of the telecom operator, and coverage of remote settlements is quite costly (cost of design work, fiber, laying of fiber-optic cable), thereby complicating the elimination of the digital divide between the city, the suburbs and the countryside. To solve this problem, it is proposed to use quantum dot semiconductor optical amplifiers (QD-SOA), which will expand the GPON reach up to 60 km, which is the limit for the logical length under the current protocols. Quantum dot semiconductor optical amplifiers are promising devices for optical communication technology, but for commercial use they have one disadvantage. They are polarization sensitive. In this paper the authors constructed a polarization diversity scheme to avoid polarization sensitivity of QD-SOAs.


2021 ◽  
Vol 11 (23) ◽  
pp. 11096
Author(s):  
Joan Manel Ramírez ◽  
Pierre Fanneau de la Horie ◽  
Jean-Guy Provost ◽  
Stéphane Malhouitre ◽  
Delphine Néel ◽  
...  

Heterogeneously integrated III-V/Si lasers and semiconductor optical amplifiers (SOAs) are key devices for integrated photonics applications requiring miniaturized on-chip light sources, such as in optical communications, sensing, or spectroscopy. In this work, we present a widely tunable laser co-integrated with a semiconductor optical amplifier in a heterogeneous platform that combines AlGaInAs multiple quantum wells (MQWs) and InP-based materials with silicon-on-insulator (SOI) wafers containing photonic integrated circuits. The co-integrated device is compact, has a total device footprint of 0.5 mm2, a lasing current threshold of 10 mA, a selectable wavelength tuning range of 50 nm centered at λ = 1549 nm, a fiber-coupled output power of 10 mW, and a laser linewidth of ν = 259 KHz. The SOA provides an on-chip gain of 18 dB/mm. The total power consumption of the co-integrated devices remains below 0.5 W even for the most power demanding lasing wavelengths. Apart from the above-mentioned applications, the co-integration of compact widely tunable III-V/Si lasers with on-chip SOAs provides a step forward towards the development of highly efficient, portable, and low power systems for wavelength division multiplexed passive optical networks (WDM-PONs).


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