Physical simulation on the 1550 nm Infrared Photon Absortion in Ge and Graphene filled Silicon Micro-hole Array

2020 ◽  
Author(s):  
Ching-Yu Hsu ◽  
Zingway Pei
Keyword(s):  
Physical Simulation ◽  
Hole Array ◽  
Micro Hole ◽  
Infrared Photon

scholarly journals Quadrilateral Micro-Hole Array Machining on Invar Thin Film: Wet Etching and Electrochemical Fusion Machining

Materials ◽  
2018 ◽  
Vol 11 (1) ◽  
pp. 160 ◽  
Author(s):  
Woong-Kirl Choi ◽  
Seong-Hyun Kim ◽  
Seung-Geon Choi ◽  
Eun-Sang Lee
Keyword(s):  
Thin Film ◽  
Wet Etching ◽  
Hole Array ◽  
Micro Hole

Key Technology of Microelectrode Array Fabrication by Ultrasonic Enhanced Micro-EDM

2007 ◽  
Author(s):  
Guanxin Chi ◽  
Weiliang Zeng ◽  
Desheng Dong ◽  
Zhenlong Wang
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Microelectrode Array ◽  
Electrical Discharge Machining ◽  
Short Circuit ◽  
High Price ◽  
Hole Array ◽  
Micro Edm ◽  
Plane Plate ◽  
Micro Hole

Micro electrical discharge machining (EDM), enhanced with ultrasonic vibration, is explored and assessed as a new technology for developing microelectrode array, for microelectrode array fabricated by LIGA has shortcomings such as complex technology and high price. Based on the mechanism of micro-EDM, micro-hole array discharges to fabricate microelectrode array by reverse copying. In the process of reverse copying, the thicker rod electrode can’t rotate, resulting in electric arc and short-circuit easily, so it is necessary to add ultrasonic vibration on the plane plate electrode. According to the technology, a set of micro-EDM system is designed and developed. On the machining system, influence of ultrasonic vibration is analysed from the way of vibration mechanics through theoretical analysis and experimental observation. Compared with machining without ultrasonic vibration, single discharging energy decreases 1/2, discharge frequency improves three times, machining efficiency increases two times and better surface quality is achieved. Finally, 5×5 arrays of microelectrode and microhole made by these microelectrode arrays are got, the diameter of single electrode is less than 30μm and height-to-width aspect ratio is more than 8, moreover these arrays of microelectrode and micro-hole have very good surface quality.

scholarly journals Vortex States of Exfoliated Bi2Sr2CaCu2O8+y Thin Films with and without Micro-Hole Array

2013 ◽  
Vol 45 ◽  
pp. 125-128
Author(s):  
S. Ooi ◽  
T. Mochiku ◽  
M. Tachiki ◽  
K. Hirata
Keyword(s):  
Thin Films ◽  
Hole Array ◽  
Vortex States ◽  
Micro Hole

Microelectrode Array Fabrication by Micro-WEDM

2009 ◽  
Vol 69-70 ◽  
pp. 79-82 ◽  
Author(s):  
Yu Kui Wang ◽  
Zhen Long Wang ◽  
Mao Sheng Li ◽  
Wei Liang Zeng ◽  
M.H. Weng
Keyword(s):  
Microelectrode Array ◽  
Electrode Array ◽  
Machining Process ◽  
Hole Array ◽  
Micro Edm ◽  
Peak Current ◽  
Micro Hole ◽  
Discharge Duration ◽  
Micro Wedm ◽  
Array Fabrication

In the paper, in order to overcome machining limits in throughput and precision because of positioning error and tool wear of a single tool electrode, a method for the microelectrode array fabrication by micro-WEDM is described and assessed. Characteristics of the microelectrode array fabrication by micro-WEDM, such as machining open voltage, pulse peak current, discharge duration and servo feed rate so on, are investigated through a series of experiments. A 10 10 squared electrode array is machined by micro-WEDM and the width of each squared electrode is about 40µm. The microelectrode array with good quality is obtained by applying decreased open voltage and peak current, increased discharge duration and optimized machining speed. Then micro hole-array is processed by applying obtained electrode array in micro-EDM method. The diameter of each squared hole in the array is about 50 µm due to appropriate control strategy that per micro pulse energy is decreased and periodic jump-down is applied during the machining process. Experiments have demonstrated that the combination process of microelectrode array fabricated by micro-WEDM and micro-hole array done by micro-EDM is a novel method of process which makes it more feasible and efficient to fabricate microelectrode array and high-density hole-array.

scholarly journals Fabrication of Micro-Hole Array on Glass Material by Abrasive Jet Machining

2019 ◽  
Vol 538 ◽  
pp. 012012
Author(s):  
Choung-Lii Chao ◽  
Wan-Hsuan Wang ◽  
Tian-Ming Chao ◽  
Wen-Chen Chou ◽  
Kung-Jeng Ma
Keyword(s):  
Hole Array ◽  
Glass Material ◽  
Abrasive Jet Machining ◽  
Micro Hole

Duplication Error and Repeated Error Analysis of Micro-Hole Array Fabrication by EMM

2010 ◽  
Vol 113-116 ◽  
pp. 1914-1917
Author(s):  
Ying Liu ◽  
Wei Liang Zeng ◽  
Zhen Long Wang
Keyword(s):  
Electric Field ◽  
Electrochemical Micromachining ◽  
Impact Factors ◽  
Hole Array ◽  
Machining Accuracy ◽  
Root Cause ◽  
Micro Hole ◽  
The Impact ◽  
Corner Turning ◽  
Array Fabrication

In the process of Electrochemical micromachining (EMM), the machining gap between tool cathode and workpiece anode is the root cause leading to the error, EMM error of Micro-hole array can be divided into duplication error and repeated error. According to the characteristics of EMM, the impact factors of micro-hole array duplication error and repeated error are analyzed. The distribution of electric field strength and scattered erosion are the most important causation resulting in duplication error. There is stray electric-field existing on electrode side, making scattered erosion to workpiece, impacting micro-hole forming processing precision, the extent of scattered erosion becomes serious with processing time growing, that is showed as phenomenon of sharp corner turning round and the phenomenon is observed carefully by experiments. While the accumulation of air bubbles in the processing region leads to the emergence of repeated error. Through theoretical and experimental analysis, measures are taked to improve machining accuracy.

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