A low-cost 4×25Gbps PAM4 module for short-reach optical interconnection

2014 ◽  
Author(s):  
Jiangwei Man ◽  
Wei Chen ◽  
Xiaolu Song ◽  
Li Zeng
Keyword(s):  
Low Cost ◽  
Optical Interconnection

Low Cost Six-Channel CWDM Transceiver Module for All Optical Interconnection

2020 ◽  
Author(s):  
Sung-Geun Kim ◽  
Hee-Dae Kim ◽  
Sung Hwan Hwang ◽  
Il Kim ◽  
Hyun-Kuk Shin ◽  
...  
Keyword(s):  
Low Cost ◽  
Optical Interconnection ◽  
All Optical ◽  
Transceiver Module

scholarly journals A V-Shape Optical Pin Interface for Board Level Optical Interconnect

2018 ◽  
Vol 10 (1) ◽  
pp. 20
Author(s):  
Nur Najahatul Huda Saris ◽  
Osamu Mikami ◽  
Azura Hamzah ◽  
Sumiaty Ambran ◽  
Chiemi Fujikawa
Keyword(s):  
Optical Networks ◽  
Optical Interconnects ◽  
Printed Circuit Boards ◽  
Data Centers ◽  
Low Cost ◽  
Optical Interconnection ◽  
Surface Mount Technology ◽  
Optical Surface ◽  
Printed Wiring Board ◽  
Surface Mount

This paper introduces a new interface of an optical pin for Printed Circuit Boards (PCBs), the V-shape cut type which is an innovation from the 90-degree cut type optical pin. The effectiveness is determined by optical characteristics through OptiCAD and by experiment. The simulation used a model of ray tracing analysis which is a one to two (split) connection function model. For the experiment, a Polymer Optical Fibre (POF) V-shape optical pin has been fabricated. It was found that the V-shaped optical pin has a multi-branched function and is applicable to optical interconnection. Full Text: PDF ReferencesMikami, O., et al. Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board. in Region 10 Conference (TENCON), 2016 IEEE. 2016. IEEE. CrossRef DeCusatis, C., Data center architectures, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 3-41. CrossRef Duranton, M., D. Dutoit, and S. Menezo, Key requirements for optical interconnects within data centers, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 75-94. CrossRef ITOH, Y., et al., Optical Coupling Characteristics of Optical Pin with 45° Micro Mirror for Optical Surface Mount Technology. Journal of The Japan Institute of Electronics Packaging, 2001. 4(6): p. 497-503. CrossRef Uchida, T. and O. Mikami, Optical surface mount technology. IEICE Transactions on Electronics, 1997. 80(1): p. 81-87. CrossRef Papakonstantinou, I., et al., Low-cost, precision, self-alignment technique for coupling laser and photodiode arrays to polymer waveguide arrays on multilayer PCBs. IEEE Transactions on Advanced Packaging, 2008. 31(3): p. 502-511. CrossRef Nakama, K., et al., Optical connection device. 2006, Google Patents. DirectLink Ramaswami, R., K. Sivarajan, and G. Sasaki, Optical networks: a practical perspective. 2009: Morgan Kaufmann. DirectLink Tong, X.C., Advanced materials for integrated optical waveguides. 2014: Springer. CrossRef

Development of low-cost elastic optical multifiber connector for optical interconnection

2012 ◽  
Author(s):  
Tsuyoshi Aoki ◽  
Hidenobu Muranaka ◽  
Shigenori Aoki ◽  
Katsuki Suematsu ◽  
Mitsuhiro Iwaya ◽  
...  
Keyword(s):  
Low Cost ◽  
Optical Interconnection

Electrical and Optical Interconnection-Technology based on Ormocer - Inorganic-Organic Hybrid Materials

2000 ◽  
Vol 628 ◽  
Author(s):  
Michael Popall ◽  
Ralf Buestrich ◽  
Frank Kahlenberg ◽  
Annika Andersson ◽  
Joacim Haglund ◽  
...  
Keyword(s):  
Thin Film ◽  
Optical Waveguides ◽  
Low Cost ◽  
Sol Gel ◽  
Optical Interconnection ◽  
Electrical Systems ◽  
Thin Film Technology ◽  
Passivation Layers ◽  
Glass Fibre Reinforced ◽  
Optical Applications

ABSTRACTPhotopatternable hybrid inorganic-organic polymers with negative resist behaviour have been developed and tested for evaluation in optical and electrical interconnection technology. They are composed of inorganic oxidic structures cross-linked or substituted by organic groups. The synthesis starts from organosilane precursors reacted by sol-gel-processing in combination with organic crosslinking of polymerisable organic functions. As a result of these functionalities the properties of the ORMOCER®s are adjusted to the particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. The main features of these materials are:• Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels.• Postbaking at moderate temperatures (120 - 170 °C) enables processing on low-cost substrates such as FR-4 (a glass-fibre reinforced epoxy-polymer).• Easily adaptable to thin film technology: spin-on with planarisation > 90 %, via diameters down to 20 μm and high aspect ratio for optical waveguides have been achieved.Synthesis, modification of the resins towards technological needs, their thin film technology and the resulting demonstrators will be discussed.

Low Si-OH ORMOCER®s for Dielectrical and Optical Interconnection Technology

2000 ◽  
Vol 628 ◽  
Author(s):  
Ralf Buestrich ◽  
Frank Kahlenberg ◽  
Michael Popall ◽  
Adelheid Martin ◽  
Oliver Rösch
Keyword(s):  
Low Cost ◽  
Sol Gel ◽  
Dielectric Constants ◽  
Route Optimization ◽  
Optical Interconnection ◽  
Low Dielectric ◽  
Catalyst Temperature ◽  
One Step ◽  
Tunable Refractive Index ◽  
Dielectric And Optical Properties

ABSTRACTORMOCER®*s (inorganic-organic hybrid polymers) with low Si-OH content were synthesized by a new sol-gel route. Optimization of the sol-gel process parameters (catalyst, temperature etc.) was performed in order to achieve reproducible low cost materials which are photo-patternable even in higher layer thicknesses up to 150 μm within one step without cracking or delamination. The materials combine low losses in the NIR region (0.2 dB/cm at 1310 nm and 0.5 dB/cm at 1550 nm without fluorination!) with low dielectric constants (3.3 at 10 kHz).Beside the dielectric and optical properties the materials have a variety of additional advantages for interconnection technology: good wetting and adhesion on various substrates (e.g. glass, silicon and several polymers), low processing temperatures (postbake below 160 °C), high thermal stability (up to 270 °C) and a tunable refractive index.Details of chemical synthesis and characterization as well as photo-lithographic processing of ORMOCER® materials are presented.

10 Gbit/s over 25 m Plastic Optical Fiber as a way for extremely low-cost optical interconnection

2010 ◽  
Author(s):  
Sven Loquai ◽  
Roman Kruglov ◽  
Olaf Ziemann ◽  
Juri Vinogradov ◽  
Christian-Alexander Bunge
Keyword(s):  
Optical Fiber ◽  
Low Cost ◽  
Optical Interconnection ◽  
Plastic Optical Fiber

Decomposition of the metastable beta titanium alloy Ti-15-3

1983 ◽  
Vol 41 ◽  
pp. 264-265
Author(s):  
Y. L. Chen ◽  
S. Fujlshiro
Keyword(s):  
Low Cost ◽  
High Strength ◽  
Alpha Phase ◽  
Thick Sheet ◽  
Omega Phase ◽  
Beta Titanium Alloy ◽  
Beta Titanium ◽  
Beta Matrix ◽  
Metastable Beta ◽  
Very High

Metastable beta titanium alloys have been known to have numerous advantages such as cold formability, high strength, good fracture resistance, deep hardenability, and cost effectiveness. Very high strength is obtainable by precipitation of the hexagonal alpha phase in a bcc beta matrix in these alloys. Precipitation hardening in the metastable beta alloys may also result from the formation of transition phases such as omega phase. Ti-15-3 (Ti-15V- 3Cr-3Al-3Sn) has been developed recently by TIMET and USAF for low cost sheet metal applications. The purpose of the present study was to examine the aging characteristics in this alloy.The composition of the as-received material is: 14.7 V, 3.14 Cr, 3.05 Al, 2.26 Sn, and 0.145 Fe. The beta transus temperature as determined by optical metallographic method was about 770°C. Specimen coupons were prepared from a mill-annealed 1.2 mm thick sheet, and solution treated at 827°C for 2 hr in argon, then water quenched. Aging was also done in argon at temperatures ranging from 316 to 616°C for various times.

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