Parallel optical links-PAROLI, a low cost 12-channel optical interconnection

2002 ◽  
Author(s):  
H. Karstensen
Keyword(s):  
Low Cost ◽  
Optical Interconnection ◽  
Optical Links

Low Cost Six-Channel CWDM Transceiver Module for All Optical Interconnection

2020 ◽  
Author(s):  
Sung-Geun Kim ◽  
Hee-Dae Kim ◽  
Sung Hwan Hwang ◽  
Il Kim ◽  
Hyun-Kuk Shin ◽  
...  
Keyword(s):  
Low Cost ◽  
Optical Interconnection ◽  
All Optical ◽  
Transceiver Module

scholarly journals A V-Shape Optical Pin Interface for Board Level Optical Interconnect

2018 ◽  
Vol 10 (1) ◽  
pp. 20
Author(s):  
Nur Najahatul Huda Saris ◽  
Osamu Mikami ◽  
Azura Hamzah ◽  
Sumiaty Ambran ◽  
Chiemi Fujikawa
Keyword(s):  
Optical Networks ◽  
Optical Interconnects ◽  
Printed Circuit Boards ◽  
Data Centers ◽  
Low Cost ◽  
Optical Interconnection ◽  
Surface Mount Technology ◽  
Optical Surface ◽  
Printed Wiring Board ◽  
Surface Mount

This paper introduces a new interface of an optical pin for Printed Circuit Boards (PCBs), the V-shape cut type which is an innovation from the 90-degree cut type optical pin. The effectiveness is determined by optical characteristics through OptiCAD and by experiment. The simulation used a model of ray tracing analysis which is a one to two (split) connection function model. For the experiment, a Polymer Optical Fibre (POF) V-shape optical pin has been fabricated. It was found that the V-shaped optical pin has a multi-branched function and is applicable to optical interconnection. Full Text: PDF ReferencesMikami, O., et al. Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board. in Region 10 Conference (TENCON), 2016 IEEE. 2016. IEEE. CrossRef DeCusatis, C., Data center architectures, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 3-41. CrossRef Duranton, M., D. Dutoit, and S. Menezo, Key requirements for optical interconnects within data centers, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 75-94. CrossRef ITOH, Y., et al., Optical Coupling Characteristics of Optical Pin with 45° Micro Mirror for Optical Surface Mount Technology. Journal of The Japan Institute of Electronics Packaging, 2001. 4(6): p. 497-503. CrossRef Uchida, T. and O. Mikami, Optical surface mount technology. IEICE Transactions on Electronics, 1997. 80(1): p. 81-87. CrossRef Papakonstantinou, I., et al., Low-cost, precision, self-alignment technique for coupling laser and photodiode arrays to polymer waveguide arrays on multilayer PCBs. IEEE Transactions on Advanced Packaging, 2008. 31(3): p. 502-511. CrossRef Nakama, K., et al., Optical connection device. 2006, Google Patents. DirectLink Ramaswami, R., K. Sivarajan, and G. Sasaki, Optical networks: a practical perspective. 2009: Morgan Kaufmann. DirectLink Tong, X.C., Advanced materials for integrated optical waveguides. 2014: Springer. CrossRef

scholarly journals Recent Advances in Equalization Technologies for Short-Reach Optical Links Based on PAM4 Modulation: A Review

2019 ◽  
Vol 9 (11) ◽  
pp. 2342 ◽  
Author(s):  
Honghang Zhou ◽  
Yan Li ◽  
Yuyang Liu ◽  
Lei Yue ◽  
Chao Gao ◽  
...  
Keyword(s):  
Low Cost ◽  
Rapid Development ◽  
Digital Signal ◽  
Pulse Amplitude ◽  
Data Rate ◽  
Future Trend ◽  
Machine Learning Algorithms ◽  
Cloud Services ◽  
Optical Links ◽  
Effective Manner

In recent years, short-reach optical links have attracted much more attention and have come to constitute a key market segment due to the rapid development of data-center applications and cloud services. Four-level pulse amplitude modulation (PAM4) is a promising modulation format to provide both a high data rate and relatively low cost for short-reach optical links. However, the direct detector and low-cost components also pose immense challenges, which are unforeseen in coherent transmission. To compensate for the impairments and to truly meet data rate requirements in a cost-effective manner, various digital signal processing (DSP) technologies have been proposed and investigated for short-reach PAM4 optical links. In this paper, an overview of the latest progress on DSP equalization technologies is provided for short-reach optical links based on PAM4 modulation. We not only introduce the configuration and challenges of the transmission system, but also cover the principles and performance of different equalizers and some improved methods. Moreover, machine learning algorithms are discussed as well to mitigate the nonlinear distortion for next-generation short-reach PAM4 links. Finally, a summary of various equalization technologies is illustrated and our perspective for the future trend is given.

Monolithic transimpedance amplifiers for low-cost wideband optical links

1997 ◽  
Vol 33 (6) ◽  
pp. 513 ◽  
Author(s):  
E.M. Bastida ◽  
V. Corso ◽  
C.A. Finardi ◽  
R.A. Fischer ◽  
V. Patiri
Keyword(s):  
Low Cost ◽  
Transimpedance Amplifiers ◽  
Optical Links

Low-Cost, High-Performance Analog Optical Links

2006 ◽  
Author(s):  
Joelle Prince ◽  
William Burns ◽  
Edward Ackerman ◽  
Charles Cox ◽  
Harold Roussell ◽  
...  
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Optical Links

Development of low-cost elastic optical multifiber connector for optical interconnection

2012 ◽  
Author(s):  
Tsuyoshi Aoki ◽  
Hidenobu Muranaka ◽  
Shigenori Aoki ◽  
Katsuki Suematsu ◽  
Mitsuhiro Iwaya ◽  
...  
Keyword(s):  
Low Cost ◽  
Optical Interconnection

scholarly journals Electrically Parallel Three-Element 980 nm VCSEL Arrays with Ternary and Binary Bottom DBR Mirror Layers

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 397
Author(s):  
Nasibeh Haghighi ◽  
James Lott
Keyword(s):  
Free Space ◽  
Low Cost ◽  
Cavity Surface ◽  
Free Space Optical ◽  
Optical Links ◽  
Sensing Applications ◽  
Free Data ◽  
Starting Point ◽  
Emitting Lasers ◽  
Vcsel Arrays

To meet the performance goals of fifth generation (5G) and future sixth generation (6G) optical wireless communication (OWC) and sensing systems, we seek to develop low-cost, reliable, compact lasers capable of sourcing 5–20 Gb/s (ideally up to 100 Gb/s by the 2030s) infrared beams across free-space line-of-sight distances of meters to kilometers. Toward this end, we develop small arrays of electrically parallel vertical cavity surface emitting lasers (VCSELs) for possible future use in short-distance (tens of meters) free-space optical communication and sensing applications in, for example, homes, data centers, manufacturing spaces, and backhaul (pole-to-pole or pole-to-building) optical links. As a starting point, we design, grow by metal–organic vapor phase epitaxy, fabricate, test, and analyze 980 nm top-emitting triple VCSEL arrays. Via on-wafer high-frequency probe testing, our arrays exhibit record bandwidths of 20–25 GHz, optical output powers of 20–50 mW, and error-free data transmission at up to 40 Gb/s—all extremely well suited for the intended 5G short-reach OWC and sensing applications. We employ novel p-metal and top mesa inter-VCSEL connectors to form electrically parallel but optically uncoupled (to reduce speckle) arrays with performance exceeding that of single VCSELs with equal total emitting areas.

Electrical and Optical Interconnection-Technology based on Ormocer - Inorganic-Organic Hybrid Materials

2000 ◽  
Vol 628 ◽  
Author(s):  
Michael Popall ◽  
Ralf Buestrich ◽  
Frank Kahlenberg ◽  
Annika Andersson ◽  
Joacim Haglund ◽  
...  
Keyword(s):  
Thin Film ◽  
Optical Waveguides ◽  
Low Cost ◽  
Sol Gel ◽  
Optical Interconnection ◽  
Electrical Systems ◽  
Thin Film Technology ◽  
Passivation Layers ◽  
Glass Fibre Reinforced ◽  
Optical Applications

ABSTRACTPhotopatternable hybrid inorganic-organic polymers with negative resist behaviour have been developed and tested for evaluation in optical and electrical interconnection technology. They are composed of inorganic oxidic structures cross-linked or substituted by organic groups. The synthesis starts from organosilane precursors reacted by sol-gel-processing in combination with organic crosslinking of polymerisable organic functions. As a result of these functionalities the properties of the ORMOCER®s are adjusted to the particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. The main features of these materials are:• Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels.• Postbaking at moderate temperatures (120 - 170 °C) enables processing on low-cost substrates such as FR-4 (a glass-fibre reinforced epoxy-polymer).• Easily adaptable to thin film technology: spin-on with planarisation > 90 %, via diameters down to 20 μm and high aspect ratio for optical waveguides have been achieved.Synthesis, modification of the resins towards technological needs, their thin film technology and the resulting demonstrators will be discussed.

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