Study on reliability improvement possibilities assuming probabilistic wind and solar generation

Author(s):  
Aleksandrs Lvovs ◽  
Ilze Priedite ◽  
Andrejs Snegirjovs
2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  

2020 ◽  
Vol 11 (3) ◽  
pp. 145-153
Author(s):  
Yongyan Zhu ◽  
Hyunchan Sung ◽  
Yoonji Kim ◽  
Sunghoon Cha ◽  
Seongwoo Jeon

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon

Author(s):  
Yuri R. Rodrigues ◽  
Morad Mohamed Abdelmageed Abdelaziz ◽  
Liwei Wang ◽  
Innocent Kamwa

Sign in / Sign up

Export Citation Format

Share Document