Distribution and Diffusion of Water in Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach

2010 ◽  
Vol 33 (2) ◽  
pp. 333-339 ◽  
Author(s):  
Seung Geol Lee ◽  
Seung Soon Jang ◽  
Jongman Kim ◽  
Gene Kim
ACS Omega ◽  
2021 ◽  
Vol 6 (4) ◽  
pp. 3390-3398
Author(s):  
Kyung Il Kim ◽  
Robin Lawler ◽  
Hyun June Moon ◽  
Pavithra Narayanan ◽  
Miles A. Sakwa-Novak ◽  
...  

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