Compact 3D Thermal Model for VLSI and ULSI Interconnect Network Reliability Verification

Author(s):  
Assaad El Helou ◽  
Archana Venugopal ◽  
Peter E. Raad
2013 ◽  
Vol 684 ◽  
pp. 551-554 ◽  
Author(s):  
Xin Xu ◽  
Jin Xi Lu

Since smart grid construction started, the intelligent substation network has become the hot topic. This paper combined with IEC61850 in the smart substation data sampling, analyzes the frequency and bandwidth characteristics of the wireless network for the current smart substation missing information content. It studies the application of wireless network reliability verification. The article discusses the application program from three following important respects: the WLAN design coverage, flow and load, application needs. It describes the key problems of the wireless network data sampling implement from the data sampling time. At the same time the futures application of the wireless network sampling in the smart substation is prospected.


1989 ◽  
Vol 50 (C2) ◽  
pp. C2-237-C2-243 ◽  
Author(s):  
H. VOIT ◽  
E. NIESCHLER ◽  
B. NEES ◽  
R. SCHMIDT ◽  
CH. SCHOPPMANN ◽  
...  

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