A Self-Consistent Substrate Thermal Profile Estimation Technique for Nanoscale ICs—Part I: Electrothermal Couplings and Full-Chip Package Thermal Model

2007 ◽  
Vol 54 (12) ◽  
pp. 3342-3350 ◽  
Author(s):  
Sheng-Chih Lin ◽  
Greg Chrysler ◽  
Ravi Mahajan ◽  
Vivek K. De ◽  
Kaustav Banerjee
Pramana ◽  
1986 ◽  
Vol 26 (2) ◽  
pp. 151-159 ◽  
Author(s):  
S K Khanna ◽  
M Sekar ◽  
A Michael David ◽  
K Govinda Rajan ◽  
P Bhaskar Rao

2016 ◽  
Vol 66 (2) ◽  
pp. 93 ◽  
Author(s):  
A. Kumar ◽  
S.C. Sati ◽  
A.K. Ghosh

<p>The design, testing and realisation aspects during the development of a medium size aerostat envelope in the present work. The payload capacity of this aerostat is 300 kg at 1 km above mean sea level. The aerostat envelope is the aerodynamically shaped fabric enclosure part of the aerostat which generally uses helium for lifting useful payloads to a specified height. The envelope volume estimation technique is discussed which provides the basis for sizing. The design, material selection, testing and realisation aspects of this aerostat envelope are also discussed. The empirical formulas and finite element analysis are used to estimate the aerodynamic, structural and other design related parameters of the aerostat. Equilibrium studies are then explained for balancing forces and moments in static conditions. The tether profile estimation technique is discussed to estimate blow by distance and tether length. A comparison of estimated and measured performance parameters during trials has also been discussed.</p>


Sign in / Sign up

Export Citation Format

Share Document