Compact Modeling of Mutual Thermal Coupling for the Optimal Design of SiGe HBT Power Amplifiers

Author(s):  
Joel M. Andrews ◽  
Curtis M. Grens ◽  
John D. Cressler
Author(s):  
Huaiyuan Zhang ◽  
Guofu Niu ◽  
Marnix B. Willemsen ◽  
Andries J. Scholten
Keyword(s):  

Electronics ◽  
2021 ◽  
Vol 10 (12) ◽  
pp. 1397
Author(s):  
Bishwadeep Saha ◽  
Sebastien Fregonese ◽  
Anjan Chakravorty ◽  
Soumya Ranjan Panda ◽  
Thomas Zimmer

From the perspectives of characterized data, calibrated TCAD simulations and compact modeling, we present a deeper investigation of the very high frequency behavior of state-of-the-art sub-THz silicon germanium heterojunction bipolar transistors (SiGe HBTs) fabricated with 55-nm BiCMOS process technology from STMicroelectronics. The TCAD simulation platform is appropriately calibrated with the measurements in order to aid the extraction of a few selected high-frequency (HF) parameters of the state-of-the-art compact model HICUM, which are otherwise difficult to extract from traditionally prepared test-structures. Physics-based strategies of extracting the HF parameters are elaborately presented followed by a sensitivity study to see the effects of the variations of HF parameters on certain frequency-dependent characteristics until 500 GHz. Finally, the deployed HICUM model is evaluated against the measured s-parameters of the investigated SiGe HBT until 500 GHz.


Author(s):  
J. Lajoinie ◽  
E. Ngoya ◽  
D. Barataud ◽  
J.M. Nebus ◽  
J. Sombrin ◽  
...  

1995 ◽  
Vol 5 (12) ◽  
pp. 435-436 ◽  
Author(s):  
U. Erben ◽  
M. Wahl ◽  
A. Schuppen ◽  
H. Schumacher
Keyword(s):  
Sige Hbt ◽  

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