A matched expansion MEMS probe card with low CTE LTCC substrate

2007 IEEE International Test Conference ◽

10.1109/test.2007.4437618 ◽

2007 ◽

Author(s):

Seong-Hun Choe ◽

Shuji Tanaka ◽

Masayoshi Esashi

Keyword(s):

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Integration of RF Circuitry and Liquid Cooling Chamber on LTCC Substrate for Tile TR Module

2020 IEEE Asia-Pacific Microwave Conference (APMC) ◽

10.1109/apmc47863.2020.9331513 ◽

2020 ◽

Author(s):

Huaiqiang Yu ◽

Lei Zhang ◽

Yulong Liu ◽

Lijun Yi

Keyword(s):

Liquid Cooling ◽

Cooling Chamber ◽

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Effects of Key Process Conditions on Warpage and Via Protrusion of LTCC Substrate

Materials and Manufacturing Processes ◽

10.1080/10426910701774726 ◽

2008 ◽

Vol 23 (2) ◽

pp. 182-187 ◽

Author(s):

Z. W. Zhong ◽

P. Arulvanan ◽

C. K. Goh

Keyword(s):

Process Conditions ◽

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A study of screen/stencil printing on LTCC substrate

Materials, Manufacturing Technology, Electronics and Information Science ◽

10.1142/9789813109384_0002 ◽

2016 ◽

Author(s):

Fei Zhao ◽

Yuan-Lan Dang

Keyword(s):

Stencil Printing ◽

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Benefits of the LTCC Substrate Configuration with an Air-Gap for Realization of RF Inductor with High Q-Factor and SRF

International Journal of Applied Ceramic Technology ◽

10.1111/j.1744-7402.2011.02695.x ◽

2012 ◽

Vol 9 (1) ◽

pp. 1-10 ◽

Author(s):

Goran J. Radosavljević ◽

Andrea M. Marić ◽

Walter Smetana ◽

Ljiljana D. Živanov

Keyword(s):

Air Gap ◽

Q Factor ◽

High Q ◽

Rf Inductor ◽

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The design of LC resonator based bandpass filter embedded in LTCC substrate

2009 2nd International Conference on Power Electronics and Intelligent Transportation System (PEITS) ◽

10.1109/peits.2009.5407013 ◽

2009 ◽

Author(s):

Ming Xu ◽

Jianwei Tian ◽

Ping Yang

Keyword(s):

Bandpass Filter ◽

Lc Resonator ◽

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Design and fabrication of a highly manufacturable MEMS probe card for high speed testing

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/18/7/075031 ◽

2008 ◽

Vol 18 (7) ◽

pp. 075031 ◽

Author(s):

Bong-Hwan Kim ◽

Jong-Bok Kim

Keyword(s):

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The Residual Stress Simulation Analysis of the Vacuum Eutectic Soldering for Metal and LTCC Substrate

Proceedings of the 2015 International Conference on Intelligent Systems Research and Mechatronics Engineering ◽

10.2991/isrme-15.2015.318 ◽

2015 ◽

Author(s):

Chuanliang Wei ◽

Dejian Zhou

Keyword(s):

Residual Stress ◽

Simulation Analysis ◽

Stress Simulation ◽

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Multi-layer probe card design with signal/power integrity for wafer-level AP test in LPDDR4 channel

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) ◽

10.1109/isemc.2016.7571707 ◽

2016 ◽

Author(s):

Jinwook Song ◽

Jonghoon Kim ◽

Shinyoung Park ◽

Eunjung Lee ◽

Joungho Kim ◽

...

Keyword(s):

Signal Power ◽

Power Integrity ◽

Wafer Level ◽

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Six-Gigahertz Equivalent Circuit Model of an RF Membrane Probe Card

IEEE Transactions on Instrumentation and Measurement ◽

10.1109/tim.2006.873809 ◽

2006 ◽

Vol 55 (3) ◽

pp. 989-994 ◽

Author(s):

S.A. Wartenberg

Keyword(s):

Equivalent Circuit ◽

Equivalent Circuit Model ◽

Circuit Model ◽

Membrane Probe ◽

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ENHANCED PROBE CARD FACILITATES AT-SPEED WAFER PROBING IN VERY HIGH DENSITY APPLICATIONS

Proceedings International Test Conference 1992 ◽

10.1109/test.1992.527920 ◽

2005 ◽

Author(s):

E. Subramanian ◽

R. Nelson

Keyword(s):

High Density ◽

Wafer Probing ◽

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