Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits
2012 ◽
Vol 28
(1)
◽
pp. 13-14
◽
An effective and efficient numerical method for thermal management in 3D stacked integrated circuits
2017 ◽
Vol 121
◽
pp. 200-209
◽
Keyword(s):
Keyword(s):