Novel Compact-Thermal-Model Approach to Estimate the Heat Spreading Effects of Flip-Chips on PCB regarding Laminar Flow Regimes

Author(s):  
Torsten Nowak ◽  
Sebastian Merbold ◽  
Christoph Egbers ◽  
Ralph Schacht
2021 ◽  
Vol 68 (4) ◽  
pp. 2919-2930 ◽  
Author(s):  
Hengliang Zhang ◽  
Paolo Giangrande ◽  
Giacomo Sala ◽  
Zeyuan Xu ◽  
Wei Hua ◽  
...  

1968 ◽  
Vol 10 (4) ◽  
pp. 363-366
Author(s):  
M. D. Wood

The note compares recently published versions of the governing gas film equations for slip-flow and turbulent flow with Reynolds equation for laminar flow. The comparison shows how approximate values of steady-state and dynamic performance parameters may be deduced for the new conditions from existing data.


Author(s):  
I A Konakhina ◽  
E M Khusnutdinova ◽  
A I Kadyirov ◽  
E K Vachagina

2004 ◽  
Vol 503 ◽  
pp. 161-170 ◽  
Author(s):  
B. GALLETTI ◽  
C. H. BRUNEAU ◽  
L. ZANNETTI ◽  
A. IOLLO

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