4D-5 Lateral Field Excited High Frequency Bulk Acoustic Wave Sensors

Author(s):  
D.F. McCann ◽  
J.M. Parks ◽  
J.M. McGann ◽  
M.P. da Cunha ◽  
J.F. Vetelino
2013 ◽  
Vol 791-793 ◽  
pp. 545-549
Author(s):  
Jia Lin Jiang ◽  
Ting Feng Ma

Lateral field excitation (LFE) acoustic wave devices, which employ two electrodes on the same surface of a piezoelectric substrate, have been found attractive in sensing applications. However, up to now, the sensitivities of pure-LFE devices based on LiNbO3 single crystal is unknown. In this work, the effective LFE exciting electric field direction of (yxl)89° LiNbO3 is determined. The calculated results showed that when the driving electric field direction is perpendicular to the crystallographic X-axis of the piezoelectric substrate, (yxl)89° LiNbO3 LFE device works on pure-LFE mode. Based on this, several LiNbO3 pure-LFE bulk acoustic wave sensors with three different electrodes are designed and fabricated. The results show that the (yxl)89° LiNbO3 LFE sensor with interdigital electrodes is 11.1 times and 2.2 times more sensitive to changes in liquid conductivity compared to traditional LFE devices with single gap circular electrodes and Archimedes spiral electrodes, respectively. The results are important for investigating high-sensitivity LFE bulk acoustic wave sensors by using LiNbO3 single crystal.


2016 ◽  
Vol 60 (1) ◽  
pp. 101-110 ◽  
Author(s):  
Ronen Fogel ◽  
Janice Limson ◽  
Ashwin A. Seshia

Resonant and acoustic wave devices have been researched for several decades for application in the gravimetric sensing of a variety of biological and chemical analytes. These devices operate by coupling the measurand (e.g. analyte adsorption) as a modulation in the physical properties of the acoustic wave (e.g. resonant frequency, acoustic velocity, dissipation) that can then be correlated with the amount of adsorbed analyte. These devices can also be miniaturized with advantages in terms of cost, size and scalability, as well as potential additional features including integration with microfluidics and electronics, scaled sensitivities associated with smaller dimensions and higher operational frequencies, the ability to multiplex detection across arrays of hundreds of devices embedded in a single chip, increased throughput and the ability to interrogate a wider range of modes including within the same device. Additionally, device fabrication is often compatible with semiconductor volume batch manufacturing techniques enabling cost scalability and a high degree of precision and reproducibility in the manufacturing process. Integration with microfluidics handling also enables suitable sample pre-processing/separation/purification/amplification steps that could improve selectivity and the overall signal-to-noise ratio. Three device types are reviewed here: (i) bulk acoustic wave sensors, (ii) surface acoustic wave sensors, and (iii) micro/nano-electromechanical system (MEMS/NEMS) sensors.


Author(s):  
Donald F. McCann ◽  
John F. Vetelino ◽  
Mitchell S. Wark ◽  
Lester A. French

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