Comprehensive Thermal SPICE Modeling of FinFETs and BEOL with Layout Flexibility Considering Frequency Dependent Thermal Time Constant, 3D Heat Flows, Boundary/Alloy Scattering, and Interfacial Thermal Resistance with Circuit Level Reliability Evaluation
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2002 ◽
Vol 45
(4-5)
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pp. 389-396
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Keyword(s):
2019 ◽
Vol 66
(6)
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pp. 2710-2714
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2004 ◽
Vol 24
(5-6)
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pp. 743-757
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