scholarly journals Six-port reflectometer in WR15 metallic waveguide for free-space sensing applications

Author(s):  
Kamel Haddadi ◽  
Christophe Loyez ◽  
Laurent Clavier ◽  
Denis Pomorski ◽  
Simon Lallemand
Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 397
Author(s):  
Nasibeh Haghighi ◽  
James Lott

To meet the performance goals of fifth generation (5G) and future sixth generation (6G) optical wireless communication (OWC) and sensing systems, we seek to develop low-cost, reliable, compact lasers capable of sourcing 5–20 Gb/s (ideally up to 100 Gb/s by the 2030s) infrared beams across free-space line-of-sight distances of meters to kilometers. Toward this end, we develop small arrays of electrically parallel vertical cavity surface emitting lasers (VCSELs) for possible future use in short-distance (tens of meters) free-space optical communication and sensing applications in, for example, homes, data centers, manufacturing spaces, and backhaul (pole-to-pole or pole-to-building) optical links. As a starting point, we design, grow by metal–organic vapor phase epitaxy, fabricate, test, and analyze 980 nm top-emitting triple VCSEL arrays. Via on-wafer high-frequency probe testing, our arrays exhibit record bandwidths of 20–25 GHz, optical output powers of 20–50 mW, and error-free data transmission at up to 40 Gb/s—all extremely well suited for the intended 5G short-reach OWC and sensing applications. We employ novel p-metal and top mesa inter-VCSEL connectors to form electrically parallel but optically uncoupled (to reduce speckle) arrays with performance exceeding that of single VCSELs with equal total emitting areas.


2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.


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